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Additive for coarsening in surface treatment process of copper foil

A technology of surface treatment and roughening treatment, applied in the field of additives, which can solve the problems of powder removal, copper powder transfer, and the inability to meet the peeling strength and appearance of copper foil and substrate.

Inactive Publication Date: 2010-12-01
JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the past, some people used to add benzoquinone, Mo, V and other elements to the electroplating solution to replace arsenic, or to use methods such as impact plating to inhibit the formation of dendritic copper on the surface of copper foil, but these methods still have the phenomenon of "dropping powder". That is, there is still the problem of "copper powder transfer", which cannot meet the requirements of peel strength between copper foil and substrate after pressing, appearance after etching, and surface resistance.

Method used

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  • Additive for coarsening in surface treatment process of copper foil
  • Additive for coarsening in surface treatment process of copper foil
  • Additive for coarsening in surface treatment process of copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Prepare coarsening solution

[0034] First add 500ml of deionized water to a 1-liter electroplating tank, then add 40g of accurately weighed copper sulfate pentahydrate, 80g of concentrated sulfuric acid with a concentration of 98%, 0.1g of sodium tungstate, and 1g of stannous sulfate, and finally use The ionized water is fixed at 1L.

[0035] After placing some tin particles in the prepared roughening solution, the roughening solution can be used to roughen the copper foil. When processing, the lead plate is used as the anode, and the copper foil is used as the cathode, the temperature is 20°C, and the current density is 12A / dm 2 . Coarsening processing time: 10 seconds.

[0036] Figure 1a , 1b It is the effect photo of copper foil after roughening treatment.

[0037] From Figure 1a It can be seen from the figure that after the copper foil is roughened by the roughening solution, the roughening effect is obvious and the stripes are clear. In the metallographic ...

Embodiment 2

[0039] Prepare the roughening solution in the same manner as in Example 1, wherein, copper sulfate 45g / L, sulfuric acid 105g / L, sodium tungstate 0.15g / L, stannous sulfate 1.5g / L.

[0040] Roughen the copper foil after placing some tin particles in the roughening solution. The temperature during processing is 35°C and the current density is 20A / dm 2 , coarsening time: 10 seconds.

[0041] From Figure 2a It can be seen from the figure that after the copper foil is roughened by the roughening solution, the roughening effect is obvious and the stripes are clear. In the metallographic photo 2b, it can be seen that the surface of the copper foil forms a star-shaped roughened surface, which is arranged regularly, but compared with the roughening effect of Example 1, it is slightly worse.

[0042] According to the present invention, the content range of copper sulfate in the roughening solution is 25-45g / L, the content range of sulfuric acid is 60-105g / L, the content range of sodi...

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Abstract

The invention discloses an additive for coarsening in the surface treatment process of a copper foil and coarsening liquid using the same. The additive is a composite additive mainly comprising sodium tungstate and stannous sulfate, wherein the addition amount of the sodium tungstate in the coarsening liquid is between 0.07 and 0.15g / L, and the addition amount of the stannous sulfate in the coarsening liquid is between 0.7 and 1.5g / L; and the coarsening liquid takes deionized water as a basic solvent, and 25 to 45g / L of copper sulfate, 60 to 105g / L of 98 percent concentrated sulfuric acid, 0.07 to 0.15g / L of sodium tungstate and 0.7 and 1.5g / L of stannous sulfate are added into the basic solvent. The additive for coarsening the surface of the copper foil meets the requirement of current environmental protection, achieves the coarsening effect which is the same as that of the conventional arsenic-containing additive, solves the problem of arsenic pollution which is troublesome for people for a long time during the surface treatment of the copper foil, and creates conditions for the sustainable development of the industry.

Description

technical field [0001] The invention relates to an additive for roughening the copper foil surface in the copper foil surface treatment process. Background technique [0002] At present, the copper foil surface treatment process adopted by various copper foil manufacturers at home and abroad can generally be summarized as: original foil - pretreatment - roughening treatment - curing (heat-resistant barrier layer) treatment - anti-oxidation treatment - -Surface treatment. [0003] Among them, the roughening treatment adopts the cathodic acid treatment process, that is, the wool foil is used as the cathode, and it is deposited 2 to 3 times in the electroplating solution of copper sulfate. The process of "roughening-curing" is carried out, so that the rough surface of the copper foil first produces loose tumors, and then is gradually surrounded and reinforced by dense and normal copper plating, so that the plated tumors do not powder or fall off. If the surface of the copper ...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 唐云志肖炳瑞李立清黄永发肖友军王平
Owner JIANGXI UNIV OF SCI & TECH