Busbar assembly, vehicle inverter module and method for cooling the inverter module

Abstract

A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.

Description

technical field [0001] The present invention relates generally to semiconductor devices, and more particularly to thermal management in power semiconductor components incorporating one or more busbars. Background technique [0002] High-end motor systems, such as those used in hybrid vehicles, are typically controlled using one or more high-power modules. For example, a traction drive system includes a drive unit (motor and gearbox) and an inverter to control the motor. The inverter and drive unit are usually located on separate chassis. [0003] Inverters typically consist of IGBTs (Insulated Gate Bipolar Transistors) and large silicon diodes. These power components are mounted (eg, soldered) on a DBC (Direct Copper) substrate comprising a copper layer with insulating ceramic layers sandwiched therein. Wire bonds or other interconnects are used to provide electrical connections between bus bars (typically thick bars of copper) and the various chips, where the bus bars pr...

AI Technical Summary

Problems solved by technology

Typically, known busbar assemblies often utilize large heat sinks or air cooling units, resulting in additional components, increased cost, and additional required space

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