Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming

A wafer-level, thermoforming technology, applied in manufacturing tools, welding equipment, microstructure technology, etc., can solve the problems of increased cost, long time, high cost, etc., and achieve the effect of low cost, simple method, and good sphericity

Active Publication Date: 2011-11-16
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods are more complex and costly
Using DRIE etching also takes a long time, further increasing the cost

Method used

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  • Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming
  • Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming
  • Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing wafer-level uniform size glass microcavities by positive pressure thermoforming includes the following steps: an array formed by engraving the same microgrooves on a silicon wafer (the size of the microgrooves is the same), and the method for etching the microgrooves can be Dry method and wet method, wet method is preferred (the depth of the microgrooves required by the present invention can be placed in the hot outgassing agent, so a shallower depth of wet etching can meet the requirements, such as a depth of 50-100 microns) , The etched multiple microgrooves have the same size (for example, 5, 10, 15, 50), and the microgrooves are connected with microchannels. The minimum groove width of the microgrooves is greater than 5 times the width of the flow channel. Place an appropriate amount of hot air release agent in at least one of the microgrooves (the hot air release agent can be placed in two or more micro grooves, and the amount of the hot air re...

Embodiment 2

[0026] A method for preparing wafer-level uniform-size glass microcavities by positive pressure thermoforming includes the following steps:

[0027] In the first step, a 5000A oxide layer is oxidized on a single-sided polished silicon wafer by a method of combining dry and wet oxygen, and the polished surface is spin-coated with AZ P4620 photoresist, and exposed and developed to remove the photoresist that needs to be etched on the surface of the microgroove. The microcavity and the microchannel shallow grooves are etched on the 4-inch Si wafer using the Si micromachining process. The microchannels connect the shallow grooves. The silicon wafer used can be a standard thickness silicon wafer with a thickness of 500 microns. The depth of the groove is 60-100 microns, and the microgroove is a square groove with a width of 2000 microns. The microchannel used to connect two microgrooves is a strip groove with a width of 50 microns. The groove length is 5 mm and connects two adjacent mi...

Embodiment 3

[0033] A method for preparing wafer-level uniform-size glass microcavities by positive pressure thermoforming includes the following steps:

[0034] In the first step, a 5000A oxide layer is oxidized on a single-sided polished silicon wafer by a method of combining dry and wet oxygen, and the polished surface is spin-coated with AZ P4620 photoresist, and exposed and developed to remove the photoresist that needs to be etched on the surface of the microgroove. The microgrooves and microchannels are etched on the 4-inch Si wafer using the Si micromachining process. The microchannels connect the microgrooves. The silicon wafer used can be a standard thickness silicon wafer with a thickness of 500 microns. The depth of the microgrooves is 60-100 micron square groove with a width of 2000 micrometers. The number of micro grooves is 15 and the same size. The microchannel groove is a strip groove with a diameter of 50 micrometers, and the groove length is 5 mm. It connects two adjacent mi...

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Abstract

The invention discloses a method for preparing a wafer-level uniform-dimension glass microcavity by positive pressure thermal forming. The method comprises the following steps of: etching an array consisting of microgrooves on a silicon wafer, and etching microchannels connecting the microgrooves, wherein the minimum groove width of the microgrooves is 5 times more than the runner width; and putting a proper amount of thermal outgassing agent into at least one microgroove, correspondingly bonding the plurality of microgrooves to form a sealed cavity by using a glass wafer, heating to soften the glass, making the thermal outgassing agent heated to release gases to generate positive pressure, acting the positive pressure on the softened glass corresponding to the plurality of microgrooves which are connected through the microchannels so as to form a spherical microcavity with uniform dimension, and cooling the microcavity. By connecting the same microgrooves through the microchannel, the inside air pressure of the microgrooves is substantially consistent, and the formed glass microcavity has uniform dimension. When the dimension of the microgrooves is far greater than that of the microchannel, the microchannels with smaller radius hardly expand due to higher additional pressure. Therefore, the glass corresponding to the microchannels can keep smooth.

Description

technical field [0001] The invention relates to a MEMS (micro-electro-mechanical system) manufacturing technology, in particular to a method for preparing a wafer-level uniform-sized glass microcavity by positive pressure thermoforming. Background technique [0002] In the field of MEMS manufacturing technology, Pyrex7740 glass (a glass containing alkaline ions, Pyrex is Corning's product brand) is an important material. It has a thermal expansion coefficient similar to that of Si materials, and has high light transmittance. High strength, and can form a high-strength bonding connection with the Si substrate by using the anodic bonding process, and a strong Si-O covalent bond is generated on the bonding surface, and its strength is even higher than that of the Si material itself. Due to such characteristics, Pyrex7740 glass is widely used in MEMS packaging, microfluidics and MOEMS (micro-optical electro-mechanical systems) and other fields. [0003] In the field of MEMS pac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/70H01L21/98H01L23/28B81C3/00
Inventor 尚金堂陈波寅张迪徐超
Owner SOUTHEAST UNIV
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