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8results about How to "Avoid process complexity" patented technology

Sulfur-carbon composite material and preparation method thereof

InactiveCN119551632Aavoid energy consumptionavoid process complexityCarbon compoundsSulfur preparation/purificationCarbon compositesSulfur deposition
The invention discloses a sulfur-carbon composite material and a preparation method thereof, and relates to the technical field of composite materials. According to the technical scheme, the method comprises the following steps: S1, adding a hydrogen sulfide aqueous solution into a reactor containing carbon powder at 5-25 DEG C, stirring while adding, and standing for 20-40 minutes; the ratio of the volume of the hydrogen sulfide aqueous solution to the total pore volume of the carbon powder is (0.9-0.95): 1; s2, adding a hydrogen peroxide aqueous solution, stirring while adding, and then standing; and S3, drying at 70-95 DEG C for 60-180 minutes to obtain the sulfur-carbon composite material. The hydrogen sulfide aqueous solution is adsorbed through the pores of the carbon powder, hydrogen peroxide is adopted to oxidize hydrogen sulfide into elemental sulfur and water, sulfur is deposited in the pores of carbon, and the sulfur-carbon composite material is formed after drying, so that the reaction is easy to occur, the sulfur deposition amount is controllable, the product is single, the product consistency is good, and the method is safe, reliable and low in energy consumption.
Owner:ZIBO TORCH ENERGY

High strength steel wire mesh skeleton composite pipe connecting piece

ActiveCN224414578URapid positioningApply pressure evenlyRubber ringInterlock
The utility model relates to pipeline connecting piece technical field and disclose a kind of high-strength steel wire mesh skeleton composite pipe connecting piece, including two high-strength steel wire mesh composite pipes, the outer wall of one end of two high-strength steel wire mesh composite pipes mutually close is all sleeved with rubber ring and connecting cover, rectangular slot is all set up in the both sides of connecting cover, and the both sides outer wall of connecting cover and rectangular slot corresponding position are fixedly installed with first fixed lug. In the utility model, by the bending pipe wall of everted of the end of composite pipe is divided, the self-adapting deformation of internal steel wire mesh skeleton is generated by the clamping force of pressing plate and connecting cover, mechanical interlock is formed, the upper and lower double fastening bolts symmetrically arranged in the both sides of connecting cover are pulled tight by the tension cooperation of first fixed lug and second fixed lug, the quick positioning and even pressure of pressing plate are realized, the bending pipe wall clamping stability is ensured, the process complexity of traditional welding or cementing is avoided, and installation can be completed by only standard tool on site.
Owner:ANHUI SUCHENG PIPELINE TECHNOLOGY CO LTD

High toughness double wire submerged arc welding method for EH36 thick plate

This invention relates to the field of high-strength steel welding technology, and in particular to a high-toughness double-wire submerged arc welding method for EH36 thick plates. The high-toughness double-wire submerged arc welding method for EH36 thick plates provided by this invention includes the following steps: processing a single-sided bevel at the welding point of the EH36 thick plate; performing multi-layer, multi-pass welding along the single-sided bevel from bottom to top using submerged arc welding; arranging the weld beads in an alternating pattern, with the two side weld beads symmetrically distributed relative to the middle weld bevel; welding the middle weld bevel first, followed by welding the two side weld beads; wherein the center-to-center distance between adjacent weld beads is 8-12 mm, and the overlap rate between adjacent weld beads is 35%-50%; the interpass temperature during the welding process is 150-200℃. By optimizing the weld bevel arrangement and welding process, subsequent weld beads exert a reasonable reheating effect on the preceding weld beads, thereby controlling the thermal cycling characteristics of the weld joint area, refining the weld microstructure, reducing the proportion of the critical coarse-grained heat-affected zone, and improving the low-temperature impact toughness of the weld metal.
Owner:NORTHEASTERN UNIV CHINA

Polylactic acid fiber and preparation method and application thereof

PendingCN122503972AGuaranteed StrengthGuaranteed crystallization effect
This invention discloses a polylactic acid (PLA) fiber, its preparation method, and its applications, belonging to the field of polymer materials technology. Through a three-step continuous chemical modification process involving ring-opening polymerization, silanization, amylation, and Schiff base grafting onto stereocomposite PLA, with modified MXene as the core functional modifier, the fiber is endowed with multiple functions including nano-reinforcement, interfacial compatibility, dynamic self-healing, and stereocomposite heat resistance. The prepared PLA fiber exhibits a tensile strength of 80-95 MPa, an elongation at break of 800-1000%, a melting point of 180-190℃, a strength retention rate of >92% after 180 days at 40℃ / 50% RH, and a scratch self-healing rate of >80% after 1 hour of heating at 80℃, while maintaining complete biodegradability. The process of this invention uses traditional melt spinning equipment, is suitable for large-scale production, and can be applied to high-end textiles, medical, filtration, and packaging fields.
Owner:JIESHOU SANBAO HONGDA LINE CO LTD

A PMP / Bio-PA nanofiber filter material with electret effect and preparation method thereof

ActiveCN115569442BElectret effect is goodavoid process complexityDispersed particle filtrationFiltration separationPolymer scienceSpinning
The present invention discloses a PMP / Bio-PA nanofiber filter material with an electret effect and a preparation method thereof, which is obtained by electrostatic spinning of PMP and Bio-PA; wherein the mass ratio of the PMP to the Bio-PA is 5-75:25-95. The present invention utilizes the complementarity of the electric polarization behavior between the two polymers PMP and Bio-PA to obtain an electrostatically spun nanofiber with excellent electret performance, selects PMP as the matrix material for fiber construction, and Bio-PA as an electret enhancer, and Bio-PA is evenly distributed in the matrix PMP fiber, thereby overcoming the bottleneck problem that the existing nanoparticle-type electret enhancer is easy to agglomerate and fall off, which brings secondary harm to human health and cannot be used in the field of medical protection, and at the same time avoids the problem that the electret melt-blown fiber is complicated in process and the electret effect is easy to decay.
Owner:GUIZHOU CHIEN YEH PLASTIC

Soft sweet sandwich quantitative integrated conveying and pouring equipment

The invention discloses soft sweet sandwich quantitative integrated conveying and pouring equipment which comprises a conveying belt, a machine table, a pouring device and at least two hoppers, the conveying belt is assembled on the machine table, a plurality of molds are installed on the conveying belt at equal intervals, and all the hoppers and the pouring device are installed on the machine table and located above the conveying belt. The hoppers are used for storing different materials, the pouring device comprises a plurality of sandwich pouring nozzles and a plurality of quantitative feeding assemblies corresponding to the hoppers, and the feeding ends in the sandwich pouring nozzles communicate with the quantitative feeding assemblies correspondingly; under the cooperative work of the unique quantitative feeding assembly and the sandwich pouring nozzle, synchronous injection and integrated forming of core materials and skin materials are achieved, the process complexity and time cost caused by step-by-step machining of the core materials and the skin materials in a traditional production mode are avoided, the production efficiency is remarkably improved, and by controlling the moving distance of a valve rod, the production efficiency is improved. The pouring quantity of the core material and the skin material can be accurately controlled, and the stable product quality is ensured.
Owner:JINJIANG YUNKAI MASCH CO LTD

LTCC microwave ceramic material and preparation method thereof

ActiveCN121948954AExcellent diffusion inhibition abilityDiffusion depth reducedFixed signal inductancesPorositySilver electrode
The invention provides an LTCC microwave ceramic material and a preparation method thereof.The LTCC microwave ceramic material is composed of glass powder and Al2O3 powder, the glass powder is mainly composed of Si-B-Ba-Ca, and a small amount of metal oxide and carbonate are added and doped; the Al2O3 powder is formed by grading at least two kinds of Al2O3 with different particle sizes, and D50 of the at least two kinds of Al2O3 with different particle sizes is not larger than 4 micrometers. By adopting the technical scheme, the dielectric constant of the material is stabilized at 7.1, the dielectric loss is as low as 0.0005, the material can be co-fired with a silver electrode at 850-900 DEG C, a sintered ceramic body is low in porosity and high in density, silver diffusion is effectively inhibited, and the material is suitable for high-frequency and high-reliability application scenes such as laminated high-frequency inductors and LTCC radio frequency devices.
Owner:TSINGHUA SHENZHEN INTERNATIONAL GRADUATE SCHOOL +2

Photosensitive thin film transistor, semiconductor substrate and preparation method thereof

PendingCN121793462ACapture efficiencyavoid process complexityHeterojunctionQuantum dot
The invention provides a photosensitive thin film transistor, a semiconductor substrate and a preparation method thereof. The photosensitive thin film transistor comprises a substrate, an active layer, a source drain electrode layer and an oxygen absorption layer. The active layer is located on the substrate; the active layer is an oxide semiconductor; the source and drain electrode layer is arranged on one side, far away from the substrate, of the active layer; the oxygen absorption layer is arranged between the substrate and the active layer and is in contact with the active layer; wherein the oxygen absorption layer is used for absorbing part of oxygen in the active layer; and the contact interface of the oxygen absorption layer and the active layer is embedded. The oxygen uptake layer is arranged to capture oxygen in the active layer to induce formation of oxygen vacancies, so that the effective band gap is reduced. The contact interface of the oxygen uptake layer and the active layer is embedded, so that the oxygen uptake layer can be directly and tightly contacted with the active layer, and oxygen atoms are efficiently captured. Extra light absorption layers such as quantum dots do not need to be introduced, and the process complexity and heterojunction interface defects caused by a traditional light absorption layer are avoided.
Owner:HKC CORP LTD