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Processing method for large breadth thin stone boards and super-thin boards

A processing method and ultra-thin plate technology, applied in the field of stone processing, can solve the problems of complex processing technology, brittleness and low yield of composite layer method, so as to improve the strength and yield of plates, improve bending strength, and improve processing. The effect of efficiency

Inactive Publication Date: 2010-12-29
SHANDONG UNIV
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Problems solved by technology

At present, the processing technology of ultra-thin plate has composite layer method and split method. The processing technology of composite layer method is complicated, but the split method cannot make the processing efficiency and yield rate both excellent.
Especially for the processing of large-scale ultra-thin stone plates with a format of ≥1000mm×1000mm, it is more likely to cause defects such as fragility and low yield

Method used

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  • Processing method for large breadth thin stone boards and super-thin boards
  • Processing method for large breadth thin stone boards and super-thin boards
  • Processing method for large breadth thin stone boards and super-thin boards

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Embodiment Construction

[0013] The technological process of the large-format stone thin plate and ultra-thin plate processing method of the present invention is: stone plate → panel drying → glue brushing and compounding → splitting and splitting → finished product thickness determination → polishing on both sides → edge trimming and chamfering → composite plate decomposition → Finished product, specifically including the following steps:

[0014] (1) if figure 1 As shown, the stone slab 2 after trimming and forming and determining the thickness is bonded and compounded with a matrix through an adhesive to form a single-sided composite stone matrix composite slab. The stone slab 2 is trimmed and formed by the trimming machine, so that the shape and size of the stone slab are unified, and the thickness is determined by the thickness gauge to ensure that the thickness is the same. After the stone plate 2 is dried by a dryer, glue is applied. The matrix 1 can be a metal plate with a thickness of ≥3 mm...

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Abstract

The invention provides a processing method for large breadth thin stone boards and super-thin boards, which comprises the following steps of: (1) splicing and combining a stone board and a base body to form a single-side compound stone base-body composite board; (2) halving and processing the single-side compound stone base-body composite board formed in the step (1) into a simple thin stone board and a composite stone board formed by compounding with the base body and the super-thin stone board; and (3) and decomposing binders through heating the composite stone board formed by compounding with the base body and the super-thin stone board processed in the step (2), and dividing the base body and the super-thin stone board into a base body and a super-thin stone board. The invention improves the bending strength of the super-thin board. Boards are not easy to break in the process of halving and processing. Compared with a general halving method for super-thin boards, the processing method can bear larger axial force. Therefore, the processing method improves the strength and the yield of boards, can realize optimal processing parameters, and can improve the processing efficiency.

Description

technical field [0001] The invention relates to a processing method for a stone thin plate and an ultra-thin plate, belonging to the technical field of stone processing. Background technique [0002] Natural stone ultra-thin boards are gradually loved by people because of their advantages such as small size, light weight, easy transportation, easy laying, and colorful colors. How to prevent the plate from breaking during processing, improve production efficiency and reduce the thickness of the processed plate has become a key issue in stone processing. At present, the processing technology of ultra-thin plates includes composite layer method and split method. The processing technology of composite layer method is complicated, and the split method cannot achieve both processing efficiency and yield. Especially for the processing of large-scale ultra-thin stone plates with a format of ≥1000mm×1000mm, it is more likely to cause defects such as fragility and low yield. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/00B32B15/04B32B7/12
Inventor 张进生赵兴虎谢东鹏高胜刘阳王志
Owner SHANDONG UNIV
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