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Epoxy resin conductive silver colloid with high adhesive strength

A kind of conductive silver glue and strength technology, applied in the direction of epoxy resin glue, conductive adhesive, non-polymer adhesive additives, etc. The effect of knot strength

Inactive Publication Date: 2011-01-05
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, many preparation technologies, new systems and methods for improving the bonding strength of conductive silver glue have been disclosed. Chinese patent application 200310117092.3 discloses a heat-cured conductive glue with high connection strength, and the connection strength of conductive glue has increased by 30-50. %, but the volume resistivity change is unstable

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0021] The preparation method of the above-mentioned conductive silver glue is: mix the novolak epoxy resin and the diluent evenly according to the above formula ratio, then add an appropriate amount of curing agent and curing accelerator and stir, and finally slowly add the silver powder in the formula ratio, continue to stir until uniform, and finally The air bubbles were removed by vacuum to prepare the conductive silver paste.

[0022] For the conductive silver glue prepared in the examples of the present invention, use a cone-plate viscometer to measure its viscosity at 25°C. After curing, use the four-probe method to measure its volume resistivity. Use the 2019- 3 method to determine the horizontal shear force.

Embodiment 1

[0023] Embodiment 1 (used as comparison)

[0024] Novolak epoxy resin 12%;

[0025] DDS 2%;

[0026] 57% 1,4-butanediol diglycidyl ether (diluent) 10%;

[0027] Silver powder 75%;

[0028] Feuron 1%;

[0029] After the above ingredients were fully mixed, a conductive silver glue was made. The horizontal shear force of the conductive silver glue was 17MPa; the volume resistivity was 5.5×10-5Ω·cm; the viscosity was 12866cP.

Embodiment 2

[0031] Novolak epoxy resin 12%;

[0032] DDS 2%;

[0033] 92% 1,4-butanediol diglycidyl ether (diluent) 10%;

[0034] Silver powder 75%;

[0035] Feuron 1%.

[0036] After the above ingredients were fully mixed, a conductive silver glue was prepared, and the horizontal shear force of the obtained conductive silver glue was 29.5MPa; the volume resistivity was 4.8×10-5Ω·cm; and the viscosity was 12510cP.

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PUM

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Abstract

The invention relates to an epoxy resin conductive silver colloid with high adhesive strength, belonging to packaging materials in the technical field of microelectronic packaging. The epoxy resin conductive silver colloid comprises epoxy resin, a curing agent, a diluent, a silver powder and a curing accelerator, wherein the curing agent is diaminodiphenylsulfone (DDS), the curing accelerator is 1,1-dimethyl-3-phenylurea (fenuron), the diluent is 1,4-butanediol diglycidyl ether, and the mass purity of the diluent is preferably 92-95 percent. The epoxy resin conductive silver colloid with high adhesive strength enhances the purity of the diluent in a common formula of the epoxy resin conductive silver colloid and efficiently enhances the adhesive strength of the epoxy resin conductive silver colloid. The curing accelerator which uses the fenuron as the DDS can lower the curing temperature.

Description

technical field [0001] The invention relates to an epoxy conductive silver adhesive with high bonding strength, which belongs to packaging materials in the technical field of microelectronic packaging. The invention relates to an adhesive, in particular to an epoxy conductive adhesive suitable for use in microelectronic devices or semiconductor components with good electrical conductivity and high bonding strength. Background technique [0002] With the rapid development of science and technology, electronic instruments are moving towards the direction of miniaturization, miniaturization and high integration, and at the same time promote the development of conductive silver glue, see a polymer and its preparation in Chinese patent application number 200710199019.3A Method and conductive adhesive containing the polymer. Because in many occasions, the product has to withstand impact, so the firmness of the conductive silver adhesive to the object, that is, whether it can with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J9/02
Inventor 王群赵秋刚郑岩王莉莉李中亮刘姝刘颖
Owner CHANGCHUN YONGGU TECH