Method for repairing open circuit of thick copper lead wire and repairing structure thereof

Abstract

The invention provides a method for repairing the open circuit of a thick lead wire, which is based on the technology of conductive paste rendering and electric brush plating. The method comprises the following steps of: 001, coating a layer of conductive paste at the position to be repaired, wherein the conductive paste is thermally cured into a first conductive paste layer; 002, playing a first copper layer on the first conductive paste layer by adopting the electric brush plating technology; 003, coating one more conductive paste layer on the first copper layer, wherein the conductive paste layer is thermally cured into a second conductive paste layer; and 004, plating a second copper layer on the second conductive paste layer by adopting the electric brush plating technology. The invention provides a repairing structure adopting the method for repairing the open circuit of the thick copper lead wire, which comprises the first conductive paste layer, the first copper layer, the second conductive paste layer and the second copper layer from the inside to the outside. The invention not only overcomes the defect of the conventional pressure welding, but also meets the requirements on the mechanical strength and electric performance of the repaired position.

Description

【Technical field】 [0001] The invention relates to a technology for repairing circuit breaks in printed circuit boards, in particular to a method for repairing circuit breaks in thick copper wires and its repair structure. 【Background technique】 [0002] There will be 1%-2% wire circuit boards in the reproduction process of printed circuit boards. Two methods can be used to repair such circuit boards. One is to use ordinary pressure welding to repair wire circuit breaks. There are three defects in this type of pressure welding. : 1. The solder joints are only on two pressure soldering points, resulting in no practical contact between the repaired copper wire and the base material at the gap of the printed circuit board, and the open circuit with a large span cannot be repaired; 2. Only small openings can be repaired There is nothing to do about broken wires and straight line wires, large-area wire wire breaks and bend wire wire wire breaks; 3. The appearance quality of the re...

AI Technical Summary

Problems solved by technology

[0002] There will be 1%-2% wire circuit boards in the reproduction process of printed circuit boards. Two methods can be used to repair such circuit boards. One is to use ordinary pressure welding to repair wire circuit breaks. There are three defects in this type of pressure welding. : 1. The solder joints are only on two pressure soldering points, resulting in no practical contact between the repaired copper wire and the base material at the gap of the printed circuit board, and the open circuit with a large span cannot be repaired; 2. Only small openings can be repaired There is nothing to do about broken wires and straight line wires, large-area wires and curved wires; 3. The appearance quality of the repaired printed board is poor

However, this chemical method cannot repair the defects of broken wires of thick copper wires, and there are problems such as insufficient mechanical strength.

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