Photocuring resin for investment casting in laser fast molding

Abstract

The invention discloses a photocuring resin for investment casting in laser fast molding. The resin comprises the following materials in percentage by mass: 30 to 55 percent of unsaturated polyester, 20 to 35 percent of epoxy resin, 20 to 40 percent of active diluent and 1 to 6 percent of light initiator. A preparation process for the resin comprises the following steps of: adding the light initiator into the active diluent, dissolving in a water bath of 40 to 60 DEG C until the light initiator is transparent, adding the unsaturated polyester and the epoxy resin, and stirring and mixing for 1 to 2 hours. The resin has low viscosity, a mold shell does not crack during roasting, the thermogravimetric curve is flat in a roasting process, the gas evolution is uniform and the carbon residue is low.

Description

technical field [0001] The invention relates to the technical field of photocurable resins, in particular to a photocurable resin for investment casting in laser rapid prototyping. technical background [0002] Since the rise of laser rapid prototyping technology in the 1980s, light-curing resins suitable for different fields have been developed at home and abroad. For investment casting, to be suitable for its molding process, the resin must be slowly ablated during the ablation process. The gas output is stable and the carbon residue is low. Referring to these requirements, a resin formula specially used for investment casting was prepared, in which bisphenol A epoxy resin is the most important component in the resin system, which affects the mechanical properties of the entire resin, but its benzene ring structure leads to In the corrosion process, the thermal decomposition temperature is high and the carbon residue is high. Therefore, using it as the main resin cannot s...

AI Technical Summary

Problems solved by technology

Referring to these requirements, a resin formula specially used for investment casting was prepared, in which bisphenol A epoxy resin is the most important component in the resin system, which affects the mechanical properties of the entire resin, but its benzene ring structure leads to During the corrosion process, the thermal decomposition temperature is high and the amount of residual carbon is high. Therefore, using it as the main resin cannot solve the defects of the ceramic shell bursting in the high temperature stage.

During the ablation process, the thermal expansion coefficients of the resin and ceramics differ by an order of magnitude, and if the thermal weight loss occurs in a narrow temperature range, a large amount of gas is generated at this time, which can easily cause the ceramic shell to burst.