Cavity type air-tight packaging method of planar carrier of microminiature microelectronic circuit
A technology of microelectronic circuit and packaging method, which is applied in the direction of circuits, electrical components, electric solid devices, etc., which can solve the problems of large volume and achieve the effect of small packaging area and low cost
Active Publication Date: 2012-07-04
SENODIA TECH (SHANGHAI) CO LTD
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Problems solved by technology
This technology can provide a sealed cavity for microelectronic circuit chips, which greatly reduces packaging costs, facilitates fully automatic operation, and improves production efficiency and yield, but its volume is still relatively large
Method used
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Embodiment Construction
[0024] The preferred embodiments of the present invention are given below in conjunction with the accompanying drawings to describe the technical solution of the present invention in detail.
[0025] The invention relates to an airtight packaging method of a planar carrier cavity for an ultra-small microelectronic circuit. The chip is fixed on a planar carrier, and after bonding, the sealant is coated, and then covered with a specially designed cover to form an airtight package. The dense cavity protects the chip. The structure of the planar carrier cavity of the ultra-small microelectronic circuit after airtight packaging is as follows:
[0026] Such as figure 1 As shown, the microelectronic circuit chip 4 is fixed on a plane carrier, the pads 2 on the plane carrier are distributed on both sides of the plane carrier, and the bonding wire 3 connects the microelectronic circuit chip 4 and the pads 2 on the plane carrier .
[0027] Such as figure 2 As shown, the bottom edge...
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The invention discloses a cavity type air-tight packaging method of a planar carrier of a microminiature microelectronic circuit, which comprises the following steps of: firstly, providing a planar carrier: designing and manufacturing the planar carrier needed for packaging a microelectronic circuit chip; secondly, attaching the chip onto the planar carrier: fixing the microelectronic circuit chip on the planar carrier and connecting the microelectronic circuit chip and a press welding block on the planar carrier together by using a gold ball welding bonding wire; thirdly, coating a rubber cover: coating sealing gum near the bonding wire for protection and insulation according to the size of a packaging cover, aligning the concave edges of the cover to a bonding wire side and covering thecover on the planar carrier; and fourthly, air-tight packaging: placing according to a curing condition required by the sealing gum, and baking or irradiating by ultraviolet light, wherein an air-tight cavity formed by the cured sealing gum and the packaging cover. In the invention, the concave edges are arranged on two sides of the packaging cover with a certain distance to the bonding wire, themetal bonding wire cannot be contacted, and the packaging rings on another two sides meet the requirements on alignment and fixation.
Description
technical field [0001] The invention relates to a microelectronic circuit chip packaging technology, in particular to an airtight packaging method for a planar carrier cavity of an ultra-small microelectronic circuit. Background technique [0002] With the rapid development of chip technology, a new generation of intelligent electronic products with light weight and small size are constantly coming out, and the requirements for the packaging volume and cost of microelectronic circuits are getting higher and higher, requiring miniaturization, light weight, high performance, and multi-function , low power consumption, and low-cost hermetic packaging. At present, the packaging methods of microelectronic circuit chips mainly include ceramic shell packaging such as LCC (ceramic leadless chip carrier), DIP (dual in-line packaging technology), QFP (quad flat packaging technology) and BGA (ball grid array technology). Packaging technology) and other plastic packaging, as well as hi...
Claims
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IPC IPC(8): H01L21/48H01L21/50
CPCH01L2224/8592H01L2224/48091H01L2224/49175H01L2224/48227H01L2924/1461
Inventor 邹波华亚平李莉
Owner SENODIA TECH (SHANGHAI) CO LTD