Flat plate-type ceramic package radiating module for high-power LED and manufacturing method thereof
A technology of ceramic packaging and heat dissipation modules, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of irregular shapes that are not conducive to large-scale production, complex heat sink structures, and cumbersome production processes, so as to reduce bottleneck thermal resistance and heat dissipation Large area, good heat dissipation effect
Active Publication Date: 2012-11-28
ZHUHAI YUEKE JINGHUA TECH
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Problems solved by technology
[0006] In addition if figure 1 As shown in , the current common solution is to solder the packaged LED lamp grains to the heat sink. The existing problems are: the structure of the heat sink is complex, and the special shape is not conducive to mass production in industrial production; moreover, the current The method used by the manufacturer is to separate the packaging of the LED lamp grains from the welding process on the heat sink, instead of directly packaging the LED chips on the heat sink with the package, so the production process is cumbersome and the cost is high.
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Embodiment Construction
[0042] refer to Figure 9 and Figure 11 The third embodiment shown is a high-power LED flat-panel ceramic packaging heat dissipation module provided by the present invention. The module is composed of multilayer ceramics with no-groove plane layer 1 and grooved plane layer 2 intersected with each other. Structural composition, wherein, the grooves of the flat layer with grooves 2 have an air inlet and an air outlet, which can allow the gas to circulate and perform heat exchange, and the grooves can increase the area in contact with the air, improving the efficiency of the module under the same volume. heat dissipation efficiency; in addition, the non-grooved planar layer 1 and the grooved planar layer 2 are made of alumina ceramic materials or aluminum nitride ceramic materials, and the thermal conductivity of alumina and aluminum nitride ceramic materials are respectively 20 -25W / m·K and 200-250W / m·K, with high thermal conductivity.
[0043] As a preferred embodiment, LEDs...
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Abstract
The invention provides a flat plate-type ceramic package radiating module with a three-dimensional wiring structure and a radiating groove and provides an integrated solution with high efficiency and high reliability for package and / or thermal management of a high-power light emitting diode (LED). The characteristics of insulation and heat conduction which need to be realized respectively throughtwo materials in the traditional scheme are realized at the same time according to the thermoelectrical separation characteristic of a ceramic material by using an integrated ceramic-metal composite material. The flat plate-type ceramic package radiating module has the advantages that: 1, the bottleneck of heat dissipation is solved, so that heat is smoothly conducted to the whole radiating module from an LED chip and is effectively dissipated to air through air natural convection formed by the radiating groove, and reduction in the temperature of the LED chip is facilitated; and 2, a flat plate-type structure with uniform specification is convenient to machine and operate and contributes to mass production and application.
Description
technical field [0001] The invention relates to a ceramic packaging substrate for LEDs, in particular to a ceramic heat dissipation heat sink suitable for high-power LEDs and a manufacturing method thereof. Background technique [0002] Since nearly 20% of residential electricity is used for lighting, while traditional incandescent lamps can only convert electrical energy into light energy with a low efficiency of about 5%, energy-saving lighting technologies with higher energy conversion efficiency are receiving worldwide attention. special attention. Among them, LED technology is currently attracting the most attention in the market due to its advantages such as high luminous efficiency, long service life, low driving voltage, good safety, fast switching response speed, and environmental friendliness. develop. [0003] Although LED lighting technology has outstanding advantages and bright application prospects, so far, it is still limited by cost and some technical probl...
Claims
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IPC IPC(8): H01L33/48H01L33/64H01L33/00
Inventor 吴崇隽张耀华谢俊超
Owner ZHUHAI YUEKE JINGHUA TECH