LED packaging process for conducting heat by using liquid metal
A LED packaging and liquid metal technology, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve the problem that the thermal conductivity of the die-bonding adhesive cannot be compared with that of metal, and the bonding between the LED chip and the metal heat sink is not tight, etc. , to achieve the effects of increasing service life and luminous efficiency, improving lamination, and controlling LED junction temperature
Inactive Publication Date: 2011-02-23
SUZHOU ZHONGZE OPTOELECTRONICS TECH
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Problems solved by technology
The heat transfer channel of the traditional LED chip packaging process is: LED chip - solid crystal adhesive - heat sink - thermal conductive adhesive - heat sink, the biggest drawback of this channel is that the LED chip and the metal heat sink are not tightly bonded, and there is a gap between the two , usually add die-bonding adhesive to fill the gap and fix the chip, and the thermal conductivity of the existing die-bonding adhesive cannot be compared with that of metal, and there is also a large thermal resistance between the die-bonding adhesive and the LED chip and the metal heat sink
Method used
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Embodiment Construction
[0018] like figure 1 Shown is a process flow diagram of the present invention, and its steps are:
[0019] ①. Firstly, a package base with pits is prepared from metal or metal alloy;
[0020] ②. Take an appropriate amount of liquid metal and inject it into the pit on the packaging base;
[0021] ③. Fix the LED chip at the pit outlet so that the chip substrate layer is in direct contact with the liquid metal for preliminary solidification;
[0022] ④. Seal the sealant at the contact between the periphery of the LED chip and the pit of the package substrate to complete the die bonding;
[0023] ⑤. After the crystal is solidified, weld gold wires on the positive and negative electrodes of the LED chip, and the other end of the gold wires is connected to the positive and negative electrodes of the LED light source;
[0024] ⑥. Finally, the fluorescent powder adhesive layer is used to potting and encapsulating.
[0025] like figure 2 Shown is a schematic diagram of the struct...
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The invention discloses an LED (light-emitting diode) packaging process for conducting heat by using a liquid metal, which comprises the following steps of: preparing a packaging base with a pit by using a metal or a metal alloy, injecting a proper amount of liquid metal into the pit on the packaging base, then fixing an LED chip at the outlet of the pit to make the bottom layer of the LED chip directly contacted with the liquid metal, sealing the contacted part of the periphery of the LED chip and the pit of the packaging base by using sealant after primary crystal fixation, welding gold threads on the anode and the cathode of the LED chip after crystal fixation, connecting the other ends of the gold threads to the positive and negative electrodes of an LED light source, and finally performing filling and sealing by using a fluorescent powder glue layer. The liquid metal injected between the substrate layer of the LED chip and the packaging base in the packaging process realizes seamless butt joint between the LED chip and a heat conducting plate so that the heat emitted by an LED is quickly conducted, the junction temperature of the LED is effectively controlled, the service life of the LED is prolonged and the luminous efficiency of the LED is increased.
Description
technical field [0001] The invention relates to an LED encapsulation process, specifically an LED encapsulation process utilizing liquid metal for heat conduction. Background technique [0002] With the increasing emergence of energy and environmental issues, the energy-saving industry and its products have received more and more attention. The energy-saving effect of semiconductor diode (LED) lighting has been recognized, but the application bottlenecks of LED such as heat dissipation and light distribution have not been completely solved. It can be solved, especially the heat dissipation problem is particularly prominent. As we all know, the luminous efficiency and life of LED chips have a certain correlation with their junction temperature, that is, the lower the junction temperature, the higher the luminous efficiency, and the longer the corresponding life. Controlling the LED junction temperature The key technology is heat dissipation and heat conduction technology. The...
Claims
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Login to View More IPC IPC(8): H01L33/64H01L33/48
CPCH01L24/32H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/12041
Inventor黄金鹿缪应明
OwnerSUZHOU ZHONGZE OPTOELECTRONICS TECH