Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2011-03-23
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to a Cu-Sn based solder and brazing Ti with it 2 AlC ceramic and copper method. Background technique
[0002] Ti 2 AlC ceramics are ternary layered ceramics M n+1 AX n One of them, it is a structure / function integrated ceramic with both metal and ceramic properties. Ti 2 The space lattice of AlC ceramics is hexagonal crystal system, and the space group is P6 3 / mmc, by Ti 6 The C octahedral layer and the two-dimensional densely packed Al atomic layer are alternately arranged. First, Ti atoms and Al atoms are combined by van der Waals force, which makes the ceramic have a layered structure and good self-lubricating properties; secondly, Ti atoms and C atoms are covalently bonded, and the Ti-C bond is firm. The combination gives the ceramics excellent physical, chemical and mechanical properties, such as high melting point, high thermal stability; good oxidation resistance; high elastic modulus and high yield strength. In addition, Al ...