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Method and equipment for manufacturing solar cell

A technology for solar cells and manufacturing methods, applied in final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve the problems of high cost, high risk, and high corrosiveness of chemical raw materials in etching procedures, so as to improve photoelectric conversion efficiency, The effect of avoiding risks and reducing costs

Inactive Publication Date: 2011-03-30
BAY PRECISION
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Problems solved by technology

[0003] However, in the above-mentioned solar cell manufacturing process, the surface of the substrate layer is usually etched into an uneven shape with highly corrosive chemical materials. This is commonly known as the etching process. Because the chemical materials used are extremely corrosive and toxic, Therefore, not only is the risk higher in the process, but the cost of the etching process is also higher

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  • Method and equipment for manufacturing solar cell
  • Method and equipment for manufacturing solar cell
  • Method and equipment for manufacturing solar cell

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0027] refer to figure 1 , figure 2 and image 3 , a preferred embodiment of the manufacturing method of the solar cell of the present invention comprises the following steps:

[0028] (A) The surface of a transparent substrate 21 is cleaned.

[0029] (B) A silicon oxide layer 22 is deposited on the top surface of a transparent substrate 21 by atmospheric pressure plasma-assisted chemical vapor deposition, and the top surface of the deposited silicon oxide layer 22 has an uneven surface. The material of the silicon oxide layer 22 is silicon dioxide, and the thickness of the silicon oxide layer 22 ranges from 50 nm to 200 nm.

[0030] (C) Removing dust from the top surface of the silicon oxide layer 22 .

[0031] (D) Sputtering a first electrode layer 23 on the top surface of the silicon oxide layer 22 . The first electrode layer 23 is a transpa...

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Abstract

The invention relates to a method and equipment for manufacturing a solar cell. The method comprises the following steps of: depositing a silicon oxide layer on the top surface of a transparent substrate by an atmospheric pressure plasma-assisted chemical vapor deposition method, wherein the top surface of the deposited silicon oxide layer is an uneven surface; sputtering a first electrode layer on the top surface of the silicon oxide layer; molding a photoelectric conversion unit on the top surface of the first electrode layer; and sputtering a second electrode layer on the top surface of the photoelectric conversion unit. The invention has the advantages that: by using an atmospheric pressure plasma-assisted chemical vapor deposition device and the atmospheric pressure plasma-assisted chemical vapor deposition method, the silicon oxide layer with the uneven surface is generated on the surface of the transparent substrate, so that the photoelectric conversion efficiency of solar energy is improved, and the danger of an etching process during manufacturing can be avoided, and the manufacturing cost can be reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a solar cell, in particular to a method for manufacturing a solar cell that can improve the photoelectric conversion efficiency of solar energy and avoid the risk of etching technology. Background technique [0002] Generally, in order to improve the photoelectric conversion efficiency of solar energy, in the production process, the substrate layer through which the light source passes is usually etched to make the surface of the substrate layer uneven, so that the light source is still reflected after being reflected on the surface of the substrate layer. into this substrate layer to reduce the proportion of light sources reflected off the solar cell. [0003] However, in the above-mentioned solar cell manufacturing process, the surface of the substrate layer is usually etched into an uneven shape with highly corrosive chemical materials. This is commonly known as the etching process. Because the che...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/0216H01L31/0236C23C14/34C23C16/44C23C16/40C23C14/06C23C28/04H01J37/32
CPCY02E10/50Y02P70/50
Inventor 黄泳钊郑博仁
Owner BAY PRECISION