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Heat dissipating device

A technology of heat sink and radiator, applied in cooling/ventilation/heating transformation, printed circuit parts, electrical components, etc., can solve the problems of complex structure of fixed plate, difficult mold design, high production cost of heat sink, etc. The effect of saving raw materials, simple structure and convenient manufacture

Inactive Publication Date: 2011-03-30
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of the fixing plate is complicated, and the mold design is difficult, so that the heat sink has a relatively high production cost

Method used

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Examples

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Embodiment Construction

[0012] See Figure 1 to Figure 3 The heat dissipation device of an embodiment of the present invention is used to dissipate heat of the electronic component 101 mounted on the circuit board 100. The heat dissipation device includes a heat absorption block 10 attached to the electronic component 101, a first heat sink 20 and a second heat sink 30, and a first heat sink connected to the heat absorption block 10 and the first and second heat sinks 20, 30, respectively. The heat pipe 40 and the second heat pipe 50, the first fan 60 and the second fan 70 respectively located on one side of the first and second radiators 20 and 30, and the first clip 80 and the second fan fixedly connected to the heat absorption block 10 The second clasp 90. The first and second clasps 80 and 90 fix the heat absorption block 10 on the circuit board 100 so as to ensure close contact between the heat absorption block 10 and the electronic component 101.

[0013] The heat absorption block 10 is made of ...

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Abstract

A heat dissipating device is used for dissipating heat of a heat emitting electronic component arranged on a circuit board and comprises a heat absorbing block adhering to the electronic component, two heat dissipators, two heat pipes respectively connected with the heat absorbing block and the two heat dissipators, two fans respectively arranged at one side of each heat dissipator and two buckle pieces, wherein each buckle piece comprises a joint part and two locking parts connected with the circuit board; the heat absorbing block is provided with a plurality of pins; and the joint part of each buckle piece is riveted with the pins on the heat absorbing block, thus fixing the heat absorbing block on the electronic component. Compared with the prior art, the heat dissipating device uses the buckle pieces to replace the fixing plates in the traditional heat dissipating devices, thus not only ensuring simple structure and convenient manufacturing but also saving the raw materials for manufacturing and substantially reducing the manufacturing cost of the heat dissipating device.

Description

Technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components. Background technique [0002] With the rapid development of the electronic information industry, the processing capacity of electronic components such as the central processing unit (CPU) has been continuously improved, resulting in an increase in heat generation. Nowadays, heat dissipation has become an important factor that affects the operating performance of computers, and it has also become a bottleneck in the practical application of high-speed processors. For thin models such as notebook computers and all-in-ones, heat dissipation is more important. [0003] Under the design of the thin model, the heat-generating electronic components such as the CPU and the upper and lower covers of the case are very close. In order to efficiently remove the heat generated by the electronic components in a limited space, the industry curre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/02H01L23/34H01L23/40
CPCH01L23/467H01L23/4006H01L23/427H01L2924/0002H01L2924/00
Inventor 廉志晟邓根平
Owner FU ZHUN PRECISION IND SHENZHEN
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