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Method for reducing thermal expansion coefficient of polybenzoxazine-based underfill

A thermal expansion coefficient and polybenzoxazine technology, which is applied in the field of reducing the thermal expansion coefficient of polybenzoxazine-based underfills, can solve the problem of reducing the thermal expansion coefficient of polybenzoxazine-based underfills and the large gap in thermal expansion coefficients , high viscosity of the system and other problems, to achieve the effects of good storage at room temperature and low temperature, high glass transition temperature and low hygroscopicity

Inactive Publication Date: 2011-04-06
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims at the gap between the thermal expansion coefficient of the existing polybenzoxazine-based bottom filler and the thermal expansion coefficient of the substrate, and the system viscosity is too high and the fluidity is not enough after filling the filler, and provides a polybenzoxazine-reducing Coefficient of thermal expansion method for oxazine-based underfills

Method used

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  • Method for reducing thermal expansion coefficient of polybenzoxazine-based underfill

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Experimental program
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Effect test

Embodiment 1

[0029] Weigh 40 parts of the mixture of monocyclic benzoxazine and epoxy resin (828EL), the mixing weight ratio is 9:1, mix at 50°C for half an hour, then add ZrWO 4 47 parts, fineness 10μm, after mixing evenly by three-roller machine, add 10 parts of curing agent phenolic resin (HRJ1166), 0.5 parts of catalyst modified imidazole (PN-H), 0.5 parts of coupling agent tetrabutyl titanate, γ- Add 0.5 parts of glycidyloxypropyltrimethoxysilane (KH-560) into the reaction kettle after mixing, and vacuumize for 45 minutes under the pressure of -0.1MPa. The samples were taken and cured step by step according to the heating process of 150°C / 1 h→160°C / 1h→170°C / 2 h, and the coefficient of thermal expansion (CTE) of the obtained cured product was 18.3 ppm / °C.

Embodiment 2

[0031] Weigh 35 parts of the mixture of bicyclic benzoxazine and phenolic resin (HRJ1166), the mixing weight ratio is 9:1, and add ZrWO after mixing at 80°C for half an hour 4 37 parts, fineness 10μm. After mixing uniformly by a three-roller machine, add 25 parts of curing agent dicyandiamide, 0.5 parts of coupling agent tetrabutyl titanate, 2 parts of γ-methacryloxypropyl trimethoxysilane (KH-570), mix After uniformity, add it into the reaction kettle, and vacuumize it for 45 minutes under the pressure of -0.1MPa. A sample was taken and cured at 150°C for 4 hours, and the CTE of the obtained cured product was 20.2 ppm / °C.

Embodiment 3

[0033]Weigh 55 parts of the mixture of bicyclic benzoxazine and epoxy resin (EPON825), the mixing weight ratio is 9:1, and add ZrW after mixing at 70°C for half an hour 2 o 8 27 parts, fineness 5μm. After mixing evenly by a three-roller machine, add 15 parts of curing agent methyl nadic acid anhydride, 1 part of catalyst modified imidazole (2PHZ), 0.5 part of coupling agent tetrabutyl titanate, aminopropyl triethoxysilane (KH- 550) 1.5 servings. After mixing evenly, add it into the reaction kettle, and vacuumize it for 45 minutes under the pressure of -0.1MPa. A sample was taken and cured at 170°C for 4 hours, and the CTE of the obtained cured product was 22.7 ppm / °C.

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Abstract

The invention relates to a method for reducing thermal expansion coefficient of a polybenzoxazine-based underfill. The method comprises the following steps of: preparing a resin mixture containing benzoxazine; adding 10 to 60 parts of negative thermal expansion coefficient filler into 25 to 60 parts of resin mixture containing benzoxazine, and mixing the filler and the resin mixture uniformly; adding 10 to 25 parts of curing agent, 0 to 2 parts of catalyst and 0.1 to 3 parts of coupling agent into the mixture of the resin mixture containing benzoxazine and the negative thermal expansion coefficient filler, and mixing the components uniformly; and putting the mixture into a reaction kettle, pumping air from the reaction kettle, and then curing the mixture. The method for reducing the thermal expansion coefficient of the polybenzoxazine-based underfill by adding the negative thermal expansion coefficient material reduces the thermal expansion coefficient of the polybenzoxazine-based underfill to approach the thermal expansion coefficient of an FR-4 substrate, and does not affect the fluidity of the system.

Description

technical field [0001] The invention relates to a method for reducing the thermal expansion coefficient of bottom filling glue, in particular to a method for reducing the thermal expansion coefficient of polybenzoxazine base bottom filling glue. Background technique [0002] The underfill process is an additional process produced with the rapid development of high-density electronic packaging technology. Its purpose is to solve the problem of thermal expansion coefficient mismatch between integrated circuit components, interconnect materials and substrates, so as to prolong the solder joints. service life and improve the thermal reliability of electronic products. Therefore, higher requirements are placed on the thermal expansion coefficient of the underfill. At present, the underfill glue on the market is mainly epoxy, which has the disadvantages of large curing shrinkage rate (3%~4%), high thermal expansion coefficient (65ppm / ℃~75ppm / ℃), etc., which is difficult to meet t...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L63/00C08L61/06C08L33/04C08K13/02C08K3/28C08K3/22C08K3/30C08K3/24C08K5/5435
Inventor 吴波王建斌陈田安
Owner YANTAI DARBOND TECH
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