The invention discloses a heat-conductive insulated
adhesive tape for a large-power light-emitting
diode (LED) and a preparation method thereof. The preparation process comprises the following steps: mixing 5-10 parts by weight of mixture consisting of
epoxy resin and
toughening resin at a weight ratio of 1:1, 5-10 parts by weight of curing agent, 0-3 parts by weight of flexibilizer, 0.5 part by weight of accelerator and 0.5-1.5 parts of
coupling agent; dissolving the obtained mixture in a
solvent, wherein the weight ratio of the
solvent to the mixture is 1:5; stirring for 1 hour, then adding 75-89 parts by weight of heat conductive filling material, and evenly mixing; and
coating the obtained mixture on a substrate and carrying out graded curing, wherein the first-stage curing temperature is 80 DEG C, the first-stage
curing time is 0.5 hour, the second-stage curing temperature is 120 DEG C, and the second-stage
curing time is 1 hour, so that a semi-cured
adhesive film is obtained. The heat-conductive insulated
adhesive tape has the advantages of
high heat conductive coefficient, high
bonding strength, low
moisture absorption, good room-low temperature storage and the like.