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Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof

A heat-conducting, insulating, and high-power technology, applied in adhesives, epoxy resin glue, semiconductor devices, etc., can solve the problems of poor mechanical properties and low thermal conductivity of heat-conducting insulating tapes, and achieve good high-temperature stability and good room-low temperature storage. , The effect of high glass transition temperature

Inactive Publication Date: 2011-08-24
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the low thermal conductivity of the thermally conductive insulating tape in the prior art, and the addition of thermally conductive fillers causes poor mechanical properties and other deficiencies, the present invention provides a thermally conductive tape with high thermal conductivity for high-power LEDs and a preparation method thereof

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Weigh 10 parts by weight of a mixture of core-shell rubber modified epoxy resin MX125 and E44 epoxy resin produced by Japan Kaneka Company (the core-shell rubber modified epoxy resin MX125 and E44 epoxy resin in the mixture The weight ratio is 1:1), 10 parts of dodecenyl succinic anhydride, 3 parts of polyurethane, 0.5 parts of tris-(dimethylaminomethyl)phenol and 1.5 parts of coupling agent tetrabutyl titanate Esters, mix the above raw materials evenly and dissolve them in the mixed solvent of MEK and DMF (the weight ratio of DMF and DMF in the mixed solvent is 1:1), the weight of the mixed solvent of MEK and DMF is the weight of the above raw material mixture 20%, that is, the mixed solvent of MEK and DMF is 5 parts by weight. After stirring for 1 hour, add 75 parts of aluminum oxide (DAW-45) with a fineness of 45 μm, and coat the obtained mixture on On the fiber grid substrate, according to the first stage curing temperature of 80 °C, curing time of 0.5 h, the second...

Embodiment 2

[0022] Weigh 10 parts by weight of a mixture of core-shell rubber modified epoxy resin MX125 and E51 epoxy resin produced by Japan Kaneka Company (the core-shell rubber modified epoxy resin MX125 and E51 epoxy resin in the mixture The weight ratio is 1:1), 10 parts of tetradecenyl succinic anhydride, 0.5 parts of tris-(dimethylaminomethyl) phenol, 3 parts of carboxyl-terminated nitrile rubber, 0.5 parts of coupling agent Aminopropyltriethoxysilane (KH-550), after uniformly mixing the above raw materials, dissolve in the mixed solvent of MEK and dipropylene glycol methyl ether (the weight ratio of DMF and dipropylene glycol methyl ether in the mixed solvent is 1: 1), the weight of the mixed solvent of MEK and dipropylene glycol methyl ether is 20% of the weight of the above-mentioned raw material mixture, that is, the weight part of the mixed solvent of MEK and dipropylene glycol methyl ether is 4.8 parts, after stirring for 1 hour, add 76 parts A mixture of alumina (fineness 4...

Embodiment 3

[0024] Weigh 10 parts by weight of a mixture of core-shell rubber-modified epoxy resin MX551 and E51 epoxy resin produced by Japan Kaneka Corporation (in this mixture, core-shell rubber-modified epoxy resin MX551 and E51 epoxy resin The weight ratio is 1:1), 10 parts of tung oil anhydride, 0.5 parts of tri-(dimethylaminomethyl) phenol, 3 parts of hydroxyl-terminated nitrile rubber, 0.5 parts of coupling agent aminopropyl triethyl Oxysilane (KH-550), mix the above raw materials evenly and dissolve in the mixed solvent of dipropylene glycol methyl ether and DMF (the weight ratio of dipropylene glycol methyl ether and DMF in the mixed solvent is 1:1), two The mixed solvent weight of propylene glycol methyl ether and DMF is 20% of above-mentioned each raw material mixture weight, promptly the mixed solvent weight portion of dipropylene glycol methyl ether and DMF is 4.8 parts, after stirring for 1 hour, add 76 parts of aluminum nitride (fine density 45 μm) and colloidal graphite (...

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Abstract

The invention discloses a heat-conductive insulated adhesive tape for a large-power light-emitting diode (LED) and a preparation method thereof. The preparation process comprises the following steps: mixing 5-10 parts by weight of mixture consisting of epoxy resin and toughening resin at a weight ratio of 1:1, 5-10 parts by weight of curing agent, 0-3 parts by weight of flexibilizer, 0.5 part by weight of accelerator and 0.5-1.5 parts of coupling agent; dissolving the obtained mixture in a solvent, wherein the weight ratio of the solvent to the mixture is 1:5; stirring for 1 hour, then adding 75-89 parts by weight of heat conductive filling material, and evenly mixing; and coating the obtained mixture on a substrate and carrying out graded curing, wherein the first-stage curing temperature is 80 DEG C, the first-stage curing time is 0.5 hour, the second-stage curing temperature is 120 DEG C, and the second-stage curing time is 1 hour, so that a semi-cured adhesive film is obtained. The heat-conductive insulated adhesive tape has the advantages of high heat conductive coefficient, high bonding strength, low moisture absorption, good room-low temperature storage and the like.

Description

technical field [0001] The invention relates to a thermally conductive adhesive tape and a preparation method thereof, in particular to a thermally conductive insulating adhesive tape for LEDs with high thermal conductivity and a preparation method thereof. Background technique [0002] With the vigorous development of the information industry, the miniaturization of large-scale integrated circuits and electronic devices has become a trend, accompanied by a sharp increase in the temperature of the chip in the package, and semiconductor components are usually sensitive to heat. Heat both brings stability and service life issues. Therefore, the problem of heat dissipation has become one of the key technologies that constrain the development of the electronics industry, especially for high-power LED products. Because LEDs generate a lot of heat while emitting light, the temperature of the chip has a great impact on the luminous efficiency and stability of the LED. According to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/04C09J163/00C09J163/02B05D7/24H01L33/56H01L33/64
Inventor 吴波王建斌陈田安
Owner YANTAI DARBOND TECH
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