Method and device for ejecting and preparing homogeneous particles by pulsing lateral parts of holes

Abstract

The invention relates to a method and a device for ejecting and preparing homogeneous particles by pulsing lateral parts of holes. The method comprises the following steps that: under the condition of pressure difference between inert gases inside and outside a melting pool, a raw material is heated to a molten state by a heater; piezoelectric ceramic is stimulated by a pulse driving signal to generate a displacement towards one side of a crucible with the holes; the displacement is transmitted to a molten body by a transmission rod and a pressing plate to ensure that a certain quantity of micro molten bodies are ejected through small holes of different sizes on the lateral part of the crucible and then perform similarly horizontal projectile motion at different initial speeds; and the ejected micro molten bodies generate different horizontal displacements during falling, so that the homogeneous particles of different particle sizes can be obtained hierarchically at the bottom. The particles prepared by the method and the device have a uniform size, homogeneous components, controllable particle sizes and high sphericity; and the method and the device are suitable for various materials with lower melting points, can meet the requirements of continuity and stability in a production process, particularly can fulfill the aim of automatic layering at the bottom, greatly improve theproduction efficiency, and fully meet the requirements and development of modern microelectronic packaging industries.

Description

technical field [0001] The invention belongs to the technical field of preparation of spherical fine particles, in particular to a method for preparing uniform particles by layering at the bottom by spraying from the side of a small hole. Background technique [0002] For uniform particles made of low melting point materials, the most widely used ones are tin ball particles used in the field of electronic packaging. In recent years, with the development of electronic devices in the direction of miniaturization and integration, higher requirements have been put forward for the precision and multi-field of the microelectronic packaging industry. Multi-component high-precision solder balls have become an important part of modern microelectronic packaging Therefore, the requirements for the composition and precision of solder balls are becoming increasingly stringent. At present, most of the solder balls used by my country's microelectronic packaging factories are imported from...

AI Technical Summary

Problems solved by technology

The known patent application number is CN200510130406.2, the purpose is to develop a vibratory spraying equipment to prepare brazing balls for high-seal packaging, but the patent has problems of insufficient precision, which cannot ensure consistent particle size, and at the same time cannot realize the bottom Hierarchical mass production targets

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