Configurational tree-shaped heat pipe radiator

A heat pipe radiator and configuration technology, applied in the field of heat dissipation devices, can solve the problems of heat dissipation performance of heat dissipation fins affected by heat source distance, poor temperature uniformity, limited heat dissipation efficiency, etc., so as to improve heat dissipation performance, efficient operation, and increase heat dissipation rate. Effect

Active Publication Date: 2011-04-27
SOUTHEAST UNIV
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Problems solved by technology

[0004] In order to solve the problems of limited heat dissipation efficiency, poor temperature uniformity and heat dissipation performance of heat dissipation ribs affected by the distance from the heat source in the existing electronic component heat sink structure design, the present invention provides a new type of radiator with configuration tree structure characteristics heat pipe radiator

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  • Configurational tree-shaped heat pipe radiator
  • Configurational tree-shaped heat pipe radiator
  • Configurational tree-shaped heat pipe radiator

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Embodiment Construction

[0028] Carry out further detailed description below in conjunction with accompanying drawing:

[0029] figure 1 A schematic diagram of the three-dimensional structure of the heat pipe radiator is given. The invention relates to a heat pipe radiator combined with characteristic fins of a tree-like structure, which is composed of a high heat-conducting substrate 4, a liquid-absorbing core 3, a heat-dissipating fin 1 and a working medium. The bifurcated connecting ribs 1 are arranged in a ring shape around the main through passage 2 . The bifurcated connecting fins 1 arranged in a ring shape form the cooling fins. A narrow cavity 5 is set in the high thermal conductivity substrate 4, and the liquid-absorbing core 4 is filled in the narrow cavity 5, and the bifurcated connection fin 1 is connected to the narrow cavity, and the through cavity 6 of the narrow cavity 5 and the heat dissipation fin is filled. with working medium. The high thermal conductivity substrate 4 is in clos...

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Abstract

The invention discloses a configurational tree-shaped heat pipe radiator. The radiator consists of a high-thermal conductivity base plate, liquid-absorption cores, a radiating fin and working media, wherein narrow cavities are formed inside the base plate; the radiating fin is connected with the narrow cavities; communicated cavities are formed inside the radiating fin; the liquid-absorption cores are filled in the narrow cavities; the working media are filled in the narrow cavities and the communicated cavities; the radiating fin has a configurational tree-shaped structure and consists of a main communicated channel and at least two forked connection fins; the forked connection fins are arranged at the periphery of the main communicated channel circularly; and the communicated cavities inside the forked connection fins are communicated with the main communicated channel. The heat pipe radiator can quickly remove the heat which is generated by a plurality of (a single) local high-temperature heat flow heat source points (point) through phase change of the working media, so that local hot points are effectively eliminated, temperature of a heating surface of the heat pipe radiator is reduced, and safe, stable and efficient operation of electronic equipment is further guaranteed.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat pipe radiator designed to realize high-efficiency and rapid heat dissipation and has the characteristics of a tree structure. The invention can be used to solve the heat dissipation problem of electronic components with multiple heat sources. Background technique [0002] With the continuous development of electronic technology, the degree of integration of semiconductor devices is getting higher and higher, and its thermal reliability indicators are becoming more and more stringent, which in turn puts forward higher requirements for the cooling and heat dissipation of electronic components. Currently, air forced convection cooling using fan and heat sink assemblies is widely used in practice due to cost and reliability requirements. Using radial radiators to cool high-power electronic components is currently the main way to solve heat dissipation problems. However, in practic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/367H05K7/20
CPCH01L2924/0002
Inventor 陈永平张程宾眭佳佳施明恒
Owner SOUTHEAST UNIV
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