Encapsulating structure of distributed feedback (DFB) fiber laser

A fiber laser, packaging structure technology, applied in the laser, the structure/shape of the active medium, laser components and other directions, can solve the problem of no high-frequency modulation function, etc., to achieve the effect of high integration, stable performance, and improved overall performance

Inactive Publication Date: 2011-04-27
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the current domestic narrow-linewidth fiber laser products do not have a high-frequency modulation function, and it is necessary to add this function when packaging to improve the overall performance of the device

Method used

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  • Encapsulating structure of distributed feedback (DFB) fiber laser
  • Encapsulating structure of distributed feedback (DFB) fiber laser
  • Encapsulating structure of distributed feedback (DFB) fiber laser

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Embodiment Construction

[0025] refer to figure 1 and 2 , the present invention provides a package for a distributed feedback fiber laser, comprising:

[0026] A base 8 is a rectangle. In order to avoid heat exchange with the outside, the base can be made of a material with low thermal conductivity, and what the present invention used is nylon material. Small load wire rope vibration isolators 9 are respectively fixed at the four corners below the base 8 to achieve the purpose of vibration reduction.

[0027] An outer package 7, in order to avoid heat exchange with the outside world, the package 7 needs to be made of a material with a small thermal conductivity, and the present invention is made of nylon material. The outer package 7 is a concave rectangle, buckled on the top of the base 8, so that there is an accommodating space between the base 8 and the outer package 7, the two opposite side walls of the outer package 7 can be concentric Two first circular holes 71 . Outer layer side wall pack...

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Abstract

The invention discloses an encapsulating structure of a distributed feedback (DFB) fiber laser. The encapsulating structure comprises a rectangular base, an outer encapsulating layer, a sound insulating board, an inner encapsulating layer and strip-shaped piezoelectric ceramic, wherein the outer encapsulating layer is an inwardly-concave rectangle and is buckled on the base so as to form an accommodating space between the base and the outer encapsulating layer; two opposite side walls of the outer encapsulating layer are concentrically provided with two first circular holes; the sound insulating board is attached to an inner wall between the base and the outer encapsulating layer and provided with two second circular holes corresponding to the two circular holes on the outer encapsulating layer; the inner encapsulating layer is a hollow rectangular shell fixed on the sound insulating board on the base and provided with two third circular holes corresponding to the two circular holes on the sound insulating board; the strip-shaped piezoelectric ceramic is fixed on the bottom surface of the inner encapsulating layer on the sound insulating board on the base; the DFB fiber laser is fixed on the upper two sides of the strip-shaped piezoelectric ceramic by bonding; and the two ends of the DFB fiber laser pass through the first, second and third circular holes.

Description

technical field [0001] The invention relates to a distributed feedback fiber laser packaging device, in particular to a packaging device that can simultaneously realize sound insulation, vibration isolation, temperature control and high-frequency modulation. Background technique [0002] At present, distributed feedback (DFB) fiber lasers can be widely used in lidar, laser ranging, coherent detection, optical communication and other fields due to their narrow linewidth and simple structure. However, the DFB fiber laser itself has some disadvantages, such as its center wavelength will drift or jitter due to the influence of ambient temperature, noise and vibration, which is extremely unfavorable to the use of the laser. [0003] The thermoelectric cooler (TEC) is used for temperature control. It is small in size and high in temperature control accuracy, but its cooling power is limited and its cooling efficiency is low. It is usually used for temperature control of small and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/067H01S3/02H01S3/042H01S3/10
Inventor 薛力芳李芳刘育梁
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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