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Silver conductive adhesive as well as preparation method and application thereof

A technology of conductive silver glue and conductive materials, applied in the direction of conductive adhesives, adhesives, adhesive additives, etc., can solve the problems of unfavorable production, long curing time of conductive adhesives, and long production cycle, so as to promote the reaction and shorten the curing time , the effect of reducing viscosity

Inactive Publication Date: 2013-06-19
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The curing time of the above-mentioned disclosed conductive adhesives is very long. On the one hand, it is difficult to meet the needs of many occasions that require rapid curing, such as the coating of electroless plating products, which require conductive silver paste to be completely cured within a few minutes or tens of minutes; On the one hand, long curing time will make the production cycle long, which is not conducive to the progress of production.

Method used

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Examples

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preparation example Construction

[0025] The present invention also provides a preparation method of conductive silver glue, the method is at normal temperature, mix base resin, curing agent, curing accelerator, α-ethyl cyanoacrylate and polyether evenly, then add conductive material and stir and mix Evenly obtain the conductive silver glue; Wherein, the base resin is epoxy resin, the curing agent is dibasic aliphatic ether amine and low molecular polyamide, and the curing accelerator is, 4,6-three-(two methylaminomethyl)-phenol.

[0026] The invention also provides an application of the conductive silver glue, comprising coating the conductive silver glue on the surface of the base material in an air environment and curing it.

[0027] According to the application of the conductive silver glue provided by the present invention, preferably, at room temperature, the curing time of the conductive silver glue on the surface of the substrate is 5-15 minutes.

[0028] According to the conductive silver glue provid...

Embodiment 1

[0031] At normal temperature, the epoxy equivalent of 100 is the bisphenol A epoxy resin of 250, the aliphatic epoxy resin of 150 is the epoxy equivalent of 50, the dibasic aliphatic epoxy resin of 2000 molecular weight is 250 Ether amine, low molecular weight polyamide with a molecular weight of 700, 30 parts by weight, 300 parts by weight of ethyl α-cyanoacrylate and 15 parts by weight of polyether are fully mixed and uniform, and then 6 parts by weight of DMP-30 are added and mixed evenly , adding 1500 parts by weight of flaky silver powder with an average size of 4 microns, stirring and dispersing to obtain conductive silver paste A1.

Embodiment 2

[0033] At normal temperature, the bisphenol A epoxy resin that 100 weight parts epoxy equivalents are 200 by weight, the aliphatic epoxy resin that 40 weight parts epoxy equivalents are 200, the dibasic aliphatic ether amine that 200 weight parts molecular weights are 1500, 20 parts by weight of low-molecular polyamide with a molecular weight of 600, 200 parts by weight of ethyl α-cyanoacrylate and 10 parts by weight of polyether are fully mixed and uniform, and then 3 parts by weight of DMP-30 are added and mixed well, and 1200 parts by weight of Flake silver powder with an average size of 6 microns was stirred and dispersed to obtain conductive silver paste A2.

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Abstract

The invention provides a silver conductive adhesive, comprising a basic resin, a curing agent, a curing accelerator and a conductive material, wherein the basic resin is epoxy resin, the curing agent is binary aliphatic ether amine and versamid, the curing accelerator is 2,4,6-tri-(dimethylaminomethyl)-phenol, and the conductive material is silver powder. The silver conductive adhesive is characterized by furthering comprising alpha-cyan ethyl acrylate and polyether. The invention further provides a preparation method and application of the silver conductive adhesive. The silver conductive adhesive prepared in the invention can be completely cured within 5-15min at room temperature (25 DEG C) and has good cohesiveness and conductivity.

Description

technical field [0001] The invention relates to a conductive silver glue and a preparation method and application thereof, belonging to the field of electronic materials. Background technique [0002] Conductive silver glue is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. Conductive silver adhesives usually use epoxy resin or polyurethane as the matrix resin of conductive silver adhesives, add flexible macromolecules such as rubber, and use long-chain flexible amines as curing agents to improve the brittleness of epoxy resins to obtain flexible and elastic conductive silver adhesives. [0003] Chinese patent CN1247729C discloses a one-component room temperature curing conductive adhesive, which uses bisphenol A epoxy resin with epoxy equivalent in the range of 200-250 and epoxy equivalent in the range of 120-150. Epoxy resin is used as matrix resin, low molecular weight polyamide or a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/06C09J9/02C09J11/06
Inventor 金启明吴波
Owner BYD CO LTD
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