Wallboard materials incorporating a microparticle matrix

A technology of matrix materials and wallboards, applied in building materials, ceramic products, thermal insulation, etc., can solve problems such as unusable and expensive

Inactive Publication Date: 2011-05-04
ASHTECH IND LLC
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the composition and structure of such particles are usually more consistent and u

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wallboard materials incorporating a microparticle matrix
  • Wallboard materials incorporating a microparticle matrix
  • Wallboard materials incorporating a microparticle matrix

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0148] Example 1 - Testing of Practical Materials of Floating Beads and Sodium Silicate

[0149] The Extendospheres TM A mixture of floating beads in the form is combined with the sodium silicate and allowed to dry and form a fire barrier material. Extendospheres with a diameter size range of 300-600 microns were combined with a sodium silicate solution (Type O from PQ Corporation) in a 1:1 weight ratio. Inject the wet slurry into the cavity around the turbine and allow to dry. which form Extendospheres TM and lumps of sodium silicate. The material was tested using an Ipro-Tek single shaft gas turbine. Tests have shown that the material has high insulation and heat resistance. The barrier is exposed to temperatures up to 1200°C. However, it was found that when the material was directly exposed to the flame for a period of more than a few minutes, the material cracked and blistered and began to lose physical strength.

example 2

[0150] Example 2 - Formation of molds to form wall panels

[0151] In one aspect, the utility material can be a wallboard panel. Panels can optionally be formed by exposing uncured wallboard to microwaves. Such formation, as well as formation of normal wall panels, may utilize molds. An example of a mold may consist of a vinyl ester resin mold having a top member and a bottom member. To form the vinyl ester resin mold a wooden form is first built. Wooden formwork can be based on such as Figure 16 shapes and sizes shown.

[0152] To form the vinyl ester resin mold, an outer wood form was attached to the wood form base using double sided tape. Any releasable adhesive or attachment structure may alternatively be used. The resin mixture was formed from 97.5 wt% vinyl ester resin mixed with 2.5 wt% methyl ethyl ketone peroxide (MEKP) catalyst. Beads in the form of Extendospheres and the resin mixture were added in a 1:1 ratio to form the core mixture. Use a mixing device...

example 3

[0153] Example 3 - Preparation of Wall Panels Using Molds

[0154] As noted above, the form of the utility material may be a wallboard panel. The panels can optionally be formed by using porous vinyl ester resin molds. First, use the Figure 17 The backing template shown cuts out the wallboard backing. Although a particular backing paper shape is shown, it should be understood that the backing paper may be of any shape or size sufficient to form a section of wallboard. Cut the facing paper into a larger rectangle that is just smaller than the backing paper. In this example, the facing paper was cut into rectangles measuring 11.625 inches by 15.25 inches. Fold the backing paper and place it in the perforated mold. The following materials can be used to form the wallboard compound:

[0155] 700g to 900g microbeads;

[0156] 1100g to 1300g sodium silicate solution, such as that sold as "O";

[0157] 300g to 500g latex binder;

[0158] 20cc to 30cc blowing agent.

[01...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A method of forming a wallboard material can include forming a mixture including microparticles, sodium silicate and vinyl acetate. The mixture can be disposed between a metallic facing membrane and a second facing membrane. The mixture can then be heat cured in a single step sufficient to form a wallboard material having the metallic facing membrane and the second facing membrane attached to a core matrix. The heat curing time is complete in less than about 1.5 hours without causing damage to the wallboard material.

Description

[0001] related application [0002] This application claims U.S. Patent Application No. 61 / 081,949 filed on July 18, 2008 and U.S. Patent Application No. 12 / 077,951 filed on March 21, 2008 (which claims U.S. Provisional Patent Application No. 60 / 919,509, U.S. Provisional Patent Application No. 60 / 961,130, filed July 17, 2007, and U.S. Provisional Patent Application No. 61 / 002,367, filed November 7, 2007) interest, said application is incorporated herein by reference in its entirety. technical field [0003] The present invention generally relates to various utility materials and / or building materials, such as wall panels and the like. Accordingly, the present invention includes the fields of chemistry, chemical engineering, manufacturing engineering, structural science and materials science. Background technique [0004] Many different types of construction or utility materials exist in the art, such as wall panel insulation, blow molded insulation, acoustic or sound atten...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): E04C2/24E04C2/26E04C2/30
CPCB28B19/0092C04B28/26C04B2111/00612C04B2201/32E04B1/90E04B2001/8419E04B2001/8461E04B2001/8476E04C2/043Y02W30/91C04B18/082C04B24/2623C04B38/10C04B20/002
Inventor M·D·基普D·L·皮尤M·D·里奇斯W·T·麦卡维尔
Owner ASHTECH IND LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap