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External heat radiator packaging structure of upright heat radiating block of chip in resin circuit board

A packaging structure and circuit board technology, applied in circuits, electrical solid state devices, semiconductor devices, etc., can solve problems such as limited, small volume and area of ​​metal-based islands, achieve strong heat dissipation capabilities, and avoid rapid aging or even burns or burns bad effect

Inactive Publication Date: 2011-05-11
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

Method used

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  • External heat radiator packaging structure of upright heat radiating block of chip in resin circuit board
  • External heat radiator packaging structure of upright heat radiating block of chip in resin circuit board
  • External heat radiator packaging structure of upright heat radiating block of chip in resin circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see Figure 5 , Figure 5 It is a schematic diagram of Embodiment 1 of the encapsulation structure of a resin circuit board chip being mounted on a heat dissipation block and externally connected to a heat sink according to the present invention. Depend on Figure 5 It can be seen that the resin circuit board chip of the present invention is mounted on a heat sink block and externally connected to a heat sink packaging structure, including a chip 3, a single-layer or multi-layer resin circuit board 9 under the chip, and a chip to a single-layer or multi-layer resin circuit board. The metal wire 5 for signal interconnection, the conductive or non-conductive heat-conducting adhesive material I2 and the plastic package 8 between the chip and the single-layer or multi-layer resin circuit board 9, and a heat dissipation device 8 is arranged above the chip 3. Block 7, between the heat dissipation block 7 and the chip 3, a conductive or non-conductive thermally conductive ad...

Embodiment 2

[0029] Embodiment 2 differs from Embodiment 1 only in that: the radiator 11 is a heat dissipation cap, such as Figure 6 .

Embodiment 3

[0031] Embodiment 3 differs from Embodiment 1 only in that: the heat sink 11 is a cooling plate, such as Figure 7 .

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PUM

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Abstract

The invention relates to an external heat radiator packaging structure of an upright heat radiating block of a chip in a resin circuit board, comprising a chip (3), a single-layer or multi-layer resin circuit board (9), a metal wire (5), an electric or dielectric heat-conducting bonding material I (2) and a plastic package body (8), wherein a heat radiating block (7) is arranged over the chip (3), and an electric or dielectric bonding material II (6) is embedded between the heat radiating block (7) and the chip (3); a heat radiator (11) is arranged over the heat radiating block (7), and an electric or dielectric bonding material III (13) is embedded between the heat radiating block (7) and the heat radiator (11). The packaging structure provided by the invention can provide strong heat radiating capability.

Description

technical field [0001] The invention relates to a packaging structure of a resin circuit board chip being mounted on a cooling block and externally connected to a radiator. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet (such as figure 1 and figure 2 As shown), so the effective area and volume of the metal-based island are very small, and at ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/367H01L23/31
CPCH01L2224/32245H01L2224/48091H01L2224/48247H01L2224/49171H01L2224/73215H01L2224/73265
Inventor 王新潮梁志忠薛海冰
Owner JCET GROUP CO LTD