Three-dimensional elliptic motion generating method and device for diamond cutter

A cutting tool and elliptical motion technology, which is applied to driving devices, manufacturing tools, metal processing equipment, etc., can solve the problems of difficulty in obtaining high-order modes, lack of flexibility, and difficulty in autonomous control, and achieve a simple and easy-to-implement generation method and device. Effect

Active Publication Date: 2011-05-18
HUAWEI TEHCHNOLOGIES CO LTD
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Problems solved by technology

To solve the existing difficulties in rod design, it is difficult to obtain the required high-order mode; the frequency of three-dimensional elliptical motion and other ellipt

Method used

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  • Three-dimensional elliptic motion generating method and device for diamond cutter
  • Three-dimensional elliptic motion generating method and device for diamond cutter
  • Three-dimensional elliptic motion generating method and device for diamond cutter

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Experimental program
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Embodiment Construction

[0024] Include the following steps:

[0025] (1) The diamond cutting tool is directly driven by three piezoelectric stacks arranged vertically along the X direction, Y direction and Z direction respectively, and a sine wave driving signal is applied to the three piezoelectric stacks respectively; by actively adjusting the three piezoelectric stacks Initial phase of the piezo stack drive signal so that the displacement output of the diamond blade contact point always maintains the same phase between the X and Z directions , always maintain a certain phase difference with the X and Z directions in the Y direction , so as to realize the elliptical motion of the diamond blade in the X-Y plane and Y-Z plane respectively, and maintain linear motion in the X-Z plane;

[0026] (2) When the rake angle and edge inclination angle of the diamond cutting tool are non-zero, it also has cutting ability in the X-Z plane. At this time, it is only necessary to adjust the phase of the sine wa...

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Abstract

The invention relates to a three-dimensional elliptic motion generating method and a three-dimensional elliptic motion generating device for a diamond cutter, which belong to the field of ultraprecise cutting and cutting of materials difficult to machine. The diamond cutter is directly driven by three piezoelectric stacks which are arranged vertically, the three piezoelectric stacks are pre-tightened by a pre-tightening bolt at the same time, and the pre-tightening forces of the three piezoelectric stacks are finely adjusted by three wedge mechanisms respectively; by actively controlling the initial phase of a three piezoelectric stack driving signal, the projections of the motion of the diamond cutter on an X-Y plane and a Y-Z plane are elliptic motions, and the projection of the motion of the diamond cutter on an X-Z plane is a reciprocating linear motion; and by regulating the parameters such as frequency and amplitude of the three piezoelectric stack driving signal, the automatic control over the three-dimensional elliptic motion track parameter of the cutter is realized. The method and the device are very simple, easy to implement and favorable for obtaining the optimal cutting machinability of the diamond cutter.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision cutting and cutting of difficult-to-machine materials, in particular to a method and device for generating three-dimensional elliptical motion of a diamond cutting tool. Background technique [0002] Precision or ultra-precision parts with complex geometric features have a wide range of application requirements in many important fields. Diamond cutting is an important processing method to create complex geometric precision or ultra-precision parts, but one of the main difficulties at present is that the range of materials that diamond can cut is still very limited. For ferrous materials such as hardened steel and hard and brittle materials such as silicon carbide, diamond cutting tools have poor machinability, often resulting in severe tool wear, deterioration of machined surface quality, and reduced machining accuracy. In order to expand the range of diamond-cuttable materials, academia ...

Claims

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Application Information

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IPC IPC(8): B23Q5/02
Inventor 周晓勤王刚林洁琼许蓬子赵绍昕
Owner HUAWEI TEHCHNOLOGIES CO LTD
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