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Semiconductor manufacturing method and system

A manufacturing method and manufacturing system technology, applied in semiconductor/solid-state device manufacturing, general control systems, control/regulation systems, etc., can solve problems such as time-consuming, increased manufacturing costs, and increased manufacturing costs, and improve advanced processes. The effect of controlling, reducing time and manufacturing costs

Active Publication Date: 2011-05-18
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the first trial production (pilot run) fails, the second trial production will increase the manufacturing cost
In other cases, it is necessary to rely on the process engineer to substitute more information or spend more time to adjust to a better initial value of the APC module, which also causes time loss and increases in manufacturing costs

Method used

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  • Semiconductor manufacturing method and system
  • Semiconductor manufacturing method and system
  • Semiconductor manufacturing method and system

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Embodiment Construction

[0024] The following is an introduction to the preferred embodiments of the present invention. Each embodiment is used to illustrate the principle of the present invention, but not to limit the present invention. The scope of protection of the present invention should be determined by the appended claims.

[0025] refer to figure 1 , which is a schematic diagram of an embodiment of the semiconductor processing system 100 . The semiconductor processing system 100 and the semiconductor processing method implemented in the system 100 are described in detail below. The semiconductor processing system 100 includes an exemplary processing tool 102 for performing semiconductor fabrication processes on one or more semiconductor wafers 104 . The semiconductor fabrication procedures performed by the processing tool 102 include deposition, thermal oxidation, implantation, lithography exposure, or ion implantation. In one embodiment, the processing tool 102 is an etch tool for etching...

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Abstract

The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe. The advanced process control of the semiconductor is continuously improved, the time and the manufacture cost are reduced.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing method and system, and more particularly, to a semiconductor manufacturing method and system capable of advanced process control for new tapout products. Background technique [0002] Advanced process control (APC) is a technology used to improve the manufacturing quality and efficiency of semiconductor integrated circuits (ICs), especially for small-sized and high-density semiconductor ICs. In the semiconductor process, when using advanced process control, the initial values ​​of the parameters in the APC module can be used to start the APC program. In the existing method, the initial value of the parameters of the APC module is manually provided by the engineer. The process engineer will manually assign this initial value based on experience or a best guess estimate. However, existing methods are limited by several problems. One of them is that there is a high probability that the resu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B13/04H01L21/00
CPCG05B19/41865H01L21/67253H01L21/67276Y02P90/02
Inventor 许志维郑育真刘文斌王舜屏卢欣荣王若飞牟忠一曾衍迪林俊贤
Owner TAIWAN SEMICON MFG CO LTD