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Boiling type radiator with high heat-conducting property

A boiling type, high thermal conductivity technology, applied in the direction of heat transfer modification, indirect heat exchangers, semiconductor devices, etc., can solve the problem of unsatisfactory heat dissipation effect, and achieve the effect of simple structure, large heat conduction, and high heat conduction and heat dissipation efficiency

Inactive Publication Date: 2011-05-25
束必锬 +2
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

So the cooling effect is still not ideal

Method used

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  • Boiling type radiator with high heat-conducting property

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Embodiment Construction

[0009] The embodiment of the heat sink of the present invention is described by taking a computer chip as an example. As shown in the figure, the working medium (1) absorbs the heat transmitted from the chip (3) in the boiling chamber (2) and boils to become a gas (5). The gas enters the condensation chamber (6) through the connecting pipe (4) and turns into a liquid (7) after releasing heat therein. The liquid gathers to the lower part of the condensation chamber due to gravity and flows into the boiling chamber through the connecting pipe. The released heat is taken away by the air (8) flowing through the outer surface of the condenser. Fan (9) is fixed on the condensing chamber for subsequent use.

[0010] It should be noted that the liquid level of the working medium should always exceed the upper limit of the chip surface in order to facilitate the heat dissipation of the entire chip surface.

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Abstract

Heating of technical equipment limits the service life and performances of equipment on many occasions, and the heat dissipation problem becomes an important problem. Heat conduction is a key task in some other devices such as a heat exchanger. The novel radiator disclosed by the invention utilizes a nucleate boiling vaporizing principle that liquid on the surface of a solid generates bubbles quickly when the liquid is heated. A working medium is boiled for vaporization and condensed in different elements of a circulating loop respectively, namely a boiling chamber and a condensation chamber, the working efficiency is improved and the system structure is simplified. Compared with other types of radiators, the novel radiator can absorb, export and emit more heat in the case of the same contact area. Meanwhile, a fan can be avoided, or the fan can operate at a lower rotation speed and thus the noise is reduced. The novel radiator can be applied to occasions requiring efficient heat dissipation or heat transfer, such as heat dissipation of a computer chip.

Description

technical field [0001] The invention relates to a heat conduction technology with high heat conduction performance in thermal engineering, and the derived heat is further dissipated into the air to form a heat sink with high heat conduction performance. It can be used for the export of heat from many heat sources in engineering. Background technique [0002] There are two main types of radiators commonly used in engineering. [0003] Traditional radiators consist of metal fins plus cooling fans. One side of the heat sink is a plane, which is in close contact with the heat source, and plays the role of heat conduction; the other side is a fin, which plays the role of heat dissipation. Use the fan to blow the air, and use the wind to strengthen and take away the heat on the fins. The radiator has simple structure and low cost, but poor heat dissipation effect. If the fan speed is increased, the heat dissipation effect can be improved to a certain extent, but the fan rotati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28F13/18H01L23/427G06F1/20
Inventor 束必锬王琴沈世德
Owner 束必锬
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