Atmospheric transmission chamber and change method of inner airflow thereof and plasma processing equipment

Abstract

The invention provides an atmospheric transmission chamber applied to plasma processing equipment, comprising a buffer and an atmospheric manipulator and the like component, and the side wall of a cavity which is corresponding to a wafer storing region of the buffer is equipped with a side wall negative pressure obtaining device, so as to generate a local airflow flown from the interior of the cavity to the exterior of the cavity on the point close to the buffer in the atmospheric transmission chamber and to timely discharge the fine particles from the position near the buffer. In addition, the invention also provided a method for changing local airflow within the atmospheric transmission chamber, and a plasma processing equipment by using the atmospheric transmission chamber and / or the method for changing local airflow within the atmospheric transmission chamber. The atmospheric transmission chamber, the method for changing local airflow within the atmospheric transmission chamber and the plasma processing equipment provided by the invention have the advantages that the particle pollution of wafers during the transmission process can be effectively reduced, and the process yield of the wafer is ensured.

Description

technical field [0001] The present invention relates to the field of microelectronic technology, in particular to an atmospheric transmission chamber, a method for changing the local airflow in the atmospheric transmission chamber, and a method for applying the above-mentioned atmospheric transmission chamber and / or changing the local airflow in the atmospheric transmission chamber A method for plasma processing equipment. Background technique [0002] In recent years, the semiconductor industry has developed rapidly and has gradually formed a large-scale and highly automated production model. With the continuous improvement of the production level, the size of processed devices such as wafers has increased from the original 200mm to 300mm. At the same time, the market has put forward higher requirements for product quality and production efficiency. Therefore, production enterprises must continuously improve and perfect their own production equipment and technological leve...

AI Technical Summary

Problems solved by technology

[0007] However, the airflow produced by the fan filter 9 first encounters the buffer 4 in the top-down flow process, and when the airflow takes away the tiny particles near the buffer 4, it will be absorbed by the buffer 4 itself. become divergent

Since the positioner 8 is located below the buffer 4, the airflow after diverging significantly weakens the cleaning ability of the particles, thus affecting the cleaning effect of the positioner 8; Contaminated on the positioner 8 and the wafer being positioned, these factors will lead to an increased probability of defective products

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