Integrated circuit element and flip chip package
A technology of integrated circuits and components, applied in the field of bump structure formation, can solve problems such as bump cracking or extra stress, reduce adhesion, etc., and achieve the effects of improving reliability, reducing possibility, and low stress
Active Publication Date: 2011-06-08
TAIWAN SEMICON MFG CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
Intermetallics can also cause bump chipping or additional stress, and thick layers of intermetallics can also reduce adhesion
Method used
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[0014] In the following description, various specific examples will be preceded to facilitate a comprehensive understanding of the present invention for those of ordinary skill in the art. However, those of ordinary skill in the art should understand that actual operations do not need to fully comply with these special cases. In some instances, structures and processes that are well known to those of ordinary skill in the art have not been described in detail to avoid unnecessarily obscuring the disclosure.
[0015] In the following description, "an embodiment" refers to a particular feature, structure, or structure to which the embodiments included in at least one embodiment are connected. Thus, references to "an embodiment" in different paragraphs are not necessarily referring to the same embodiment. Furthermore, particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner. It should be understood that the following ...
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Abstract
The present invention discloses an integrated circuit element and a flip chip package. The integrated circuit element includes a semiconductor substrate; a bonding pad area arranged on the semiconductor substrate; a copper pillar bump arranged on the bonding pad area and electrically connected to the bonding pad area; the surface of the copper pillar bump is covered with a barrier layer formed of a copper-containing material layer including a group III element, a group IV element, a group V element or combinations thereof. The barrier layer depresses the copper diffusion and reaction with solder so as to reduce the thickness of intermetallic compound between the pillar pump and solder. According to the invention, it is possible to reduce possibility of bump cataclasm and improve reliability of the copper pillar bump. The invention has a low stress.
Description
technical field [0001] The invention relates to an integrated circuit element, flip-chip packaging, and a method for forming the integrated circuit element, in particular to a method for forming a bump structure in the integrated circuit element. Background technique [0002] Existing integrated circuits are composed of millions of active elements such as transistors and capacitors arranged horizontally. These components are isolated from each other in the preliminary process, but in the back-end process, the components will be connected with interconnects to form a functional circuit. A typical interconnect structure includes horizontal interconnects such as metal lines, and vertical interconnects such as vias and contacts. The upper limit of the performance and density of existing integrated circuits depends on the interconnection. Bond pads may be formed and exposed on the surface of individual chips on top of the interconnect structure. Electrical connections may be m...
Claims
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Login to View More IPC IPC(8): H01L23/00H01L23/488H01L23/498
CPCH01L2924/01006H01L2924/00013H01L24/11H01L2924/01075H01L2224/81815H01L2924/01038H01L2924/01012H01L2224/05181H01L2224/05027H01L2224/13647H01L2924/01022H01L2924/01047H01L2224/13082H01L2924/01079H01L24/13H01L2924/01013H01L2924/01322H01L2924/14H01L2924/01051H01L2924/01078H01L2224/03912H01L2224/16225H01L2224/1146H01L2924/04953H01L2224/10145H01L2224/13099H01L2924/01049H01L2924/01327H01L2224/05166H01L2924/01082H01L2924/01046H01L2224/11827H01L2224/16507H01L2924/01027H01L2224/1145H01L2924/04941H01L2924/01073H01L2924/01015H01L2924/01005H01L2924/01033H01L2224/05572H01L2224/11452H01L2924/01019H01L24/16H01L2924/13091H01L2924/014H01L2224/05186H01L2924/01025H01L2224/1147H01L2224/05647H01L2224/13111H01L2924/01023H01L2924/01032H01L2224/16227H01L2224/13147H01L2924/19041H01L2924/01029H01L2224/81191H01L2924/01024H01L2924/0104H01L2224/0345H01L2924/0103H01L2924/1306H01L2924/1305H01L2924/00014H01L2924/0002H01L2924/3651H01L2224/0401H01L2224/13083H01L2224/13006H01L2224/1308H01L2224/13599H01L2224/05599H01L2224/05099H01L2224/29099H01L2224/29599H01L2924/05H01L2924/00012H01L2924/01083H01L2924/00H01L2224/05552
Inventor 黄见翎吴逸文刘重希
Owner TAIWAN SEMICON MFG CO LTD