Hot air leveling machining tool for ceramic-based printed circuit board and application of hot air leveling machining tool

Abstract

According to a hot air leveling machining tool for the ceramic-based printed circuit board and application of the hot air leveling machining tool, a rectangular frame is formed by four straight edgesof a bottom frame in the tool, and the length and the width of the internal space of the rectangular frame are smaller than those of the ceramic-based printed circuit board. The three straight edges are respectively fixed with a gasket and a baffle, the baffle is fixed on the upper surface of the gasket, one end of the baffle, which is positioned on the inner side of the bottom frame, is covered with the gasket, and the distance between the gasket on one straight edge in a group of parallel straight edges and the gasket on the other straight edge is greater than the width of the ceramic-basedprinted circuit board to be processed. During application, the ceramic-based printed circuit board is dried at the temperature of 70-100 DEG C, and scaling powder is coated and then the scaling powderis inserted between the bottom frame and all the baffle plates along the horizontal direction. Then the straight edge, without the gasket and the baffle, of the bottom frame is vertically upward, theceramic-based printed circuit board is immersed in the welding flux under the clamping condition, then hot air leveling operation is carried out, the finished product rate of products is high, and the machining cost of the ceramic-based printed circuit board is reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a ceramic base printed circuit board hot air leveling processing tool and its application. Background technique [0002] Due to the high hardness and good heat resistance of ceramics, ceramic-based printed circuit boards are widely used in circuits such as power supplies and high currents. [0003] Ceramics are inorganic materials with high brittleness. When the ceramic-based printed circuit boards that need to be sprayed with tin are processed by hot air, the ceramic-based printed circuit boards are immersed in the molten tin bath. Due to the high-temperature hot air blowing, it is easy to appear The ceramic-based printed circuit board is broken, and the product yield is low. Contents of the invention [0004] Aiming at the problems existing in the prior art, the present invention provides a ceramic-based printed circuit board hot-air leveling process...

AI Technical Summary

Problems solved by technology

[0003] Ceramics are inorganic materials with high brittleness. When the ceramic-based printed circuit boards that need to be sprayed with tin are processed by hot air leveling, the ceramic-based printed circuit boards are immersed in the molten tin bath. Due to the high-temperature hot air blowing, it is easy to appear Ceramic-based printed circuit boards are broken, and the product yield is low

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