Capacitor packaging structure using surface mounting technology
A surface mount technology and packaging structure technology, applied in the direction of capacitor case/package, capacitors, electrolytic capacitors, etc., can solve the problems of uneven formation of electrolyte layer, increased leakage current, and easy damage, so as to reduce welding difficulty and reduce Leakage current, effect of reducing equivalent series resistance
Inactive Publication Date: 2013-05-29
钰邦电子(无锡)有限公司
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Problems solved by technology
However, the electrolyte layer made of polypyrrole has the disadvantage that it cannot be uniformly formed on the surface of the aluminum foil and is easily damaged.
Therefore, the aforementioned multilayer type solid electrolytic capacitor has problems of increased leakage current, short circuit, etc.
Method used
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Embodiment Construction
[0066] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0067] Such as Figure 1A to Figure 1C As shown, Embodiment 1 of the present invention provides a capacitor packaging structure using surface mount technology (SMT), which includes: a substrate unit 1a, a capacitor module 2a and a packaging unit 3a.
[0068] Wherein, the substrate unit 1a has an insulating body 10a, at least two first upper conductive layers 11a and second upper conductive layers 12a separated from each other and formed on the upper surface of the insulating body 10a, at least two separated from each other and formed on the insulating body 10a. The first lower conductive layer 13a and the second lower conductive layer 14a on the lower surface of the...
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The invention discloses a capacitor packaging structure using a surface mounting technology, which comprises: a substrate unit, a capacitor module and a packaging unit, wherein the substrate unit is provided with an insulating main body, at least two first and second upper conducting layers formed on an upper surface of the main body, at least two first and second lower conducting layers formed on a lower surface of the main body, at least two penetration holes and at least two intermediate conducting layers; the capacitor module is provided with a plurality of capacitor units arranged on themain body of the substrate; and each capacitor unit is formed by laminating a negative foil, isolating paper absorbed with conducting high molecules, a positive foil, isolating paper absorbed with the conducting high molecules and a negative foil sequentially, wherein a silver adhesive or a silver paste is coated between every two capacitor units; the positive foils of the plurality of capacitor units are positive poles connected together electrically; the negative foils of the plurality of capacitor units are negative poles and connected together electrically; and the positive foils are isolated from the negative foils.
Description
technical field [0001] The present invention relates to a capacitor packaging structure, in particular to a capacitor packaging structure using surface mount technology. Background technique [0002] Capacitors have been widely used in basic components such as consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include: filtering, bypassing, rectifying, coupling, decoupling, Turn equal. It is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. [0003] In the prior art, aluminum foils used for aluminum electrolytic capacitors are usually divided into positive foils and negative foils, which must be corroded and formed before they can be used in electrolytic capacitors. C...
Claims
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IPC IPC(8): H01G9/08H01G9/14
Inventor 邱继皓林清封樊雨心陈明宗
Owner 钰邦电子(无锡)有限公司