Method for fabricating circuit board

Abstract

The method for fabricating a circuit board comprises the following steps: a circuit board including a product area and a non-product area surrounding the product area is provided with a first insulating layer, a first copper foil layer formed on one side of the first insulating layer, and lateral surfaces; a first circuit graph is formed in the first copper foil layer corresponding to the productarea, the first copper foil layer corresponding to the non-product area is removed to enable that part of the first insulating layer is exposed out of the lateral surfaces or one side near to the first copper foil layer, and the first circuit graph comprises a first conductive circuit; insulation covering layers are respectively formed on the lateral surfaces of the circuit board and the surface in the non-product area with the first insulating layer exposed out of one side of the first copper foil layer; a solder mask layer is formed on the surface of the first conductive circuit; and the non-product area is separated from the product area, so that the circuit board formed by the product area is obtained.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of high-density interconnect circuit boards, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M -880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] In the process of making circuit boards, double-sided copper-clad laminates are usually used. Double-sided copper-clad laminates usually include two layers of copper foil and an insulating layer sandwiched between the two copper foils. The insulating layer is usually made of glass fiber cloth and glue. become. In the process of making the circuit, it is necessary ...

AI Technical Summary

Problems solved by technology

During the etching process, since the copper foil at the edge of the copper clad laminate is etched away, the insulating layer is exposed, and the exposed glass fiber, glue and other materials are easy to be used in subsequent surface treatment processes, such as gold plating, printing solder mask green paint, etc. The generation of foreign matter and impurities can easily cause defective products, and not only pollute the equipment in the subsequent process, but also cause defective circuit board products

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