LED (light emitting diode) illumination device with high lighting effect and high color rendering properties

A technology of LED lighting and high color rendering, which is applied to semiconductor devices of light-emitting elements, parts of lighting devices, lighting devices, etc. The effect of small loss and lower junction temperature

Inactive Publication Date: 2011-07-13
东莞市远大光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Packaging materials (such as silica gel, etc.) are prone to aging under the irradiation of ultraviolet light, shortening their lifespan, which will lead to serious color drift of LEDs

Method used

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  • LED (light emitting diode) illumination device with high lighting effect and high color rendering properties
  • LED (light emitting diode) illumination device with high lighting effect and high color rendering properties

Examples

Experimental program
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Effect test

Embodiment Construction

[0025] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] Such as figure 1 As shown, the high-efficiency and high-color-rendering LED lighting device described in the present invention includes a metal heat sink 1 and several RGB tricolor LED chips 3 . A circuit layer is provided on the front of the metal heat sink 1, and several grooves 2 are arranged on the front of the metal heat sink 1, and the grooves 2 are arc-shaped grooves, or square grooves. The RGB three-primary-color LED chip 3 is packaged in the groove 2, and the gap between the RGB three-primary-color LED chip 3 and the groove 2 is filled with heat-conducting insulating glue. The metal heat sink 1 is provided with LED chip pads 4 electrically connected to the circuit layer on both sides of each groove 2 , and the LED chip pads 4 are electrically connected to the two poles of the RGB tricolor LED chips 3 thr...

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PUM

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Abstract

The invention discloses an LED (light emitting diode) illumination device with a high lighting effect and high color rendering properties. The device comprises a metal radiating piece (1) and a plurality of LED chips (3) of RGB (red, green and blue) three primary colors, wherein the frontage of the metal radiating piece (1) is provided with a circuit layer and a plurality of grooves (2); the LED chips (3) of RGB three primary colors are packaged in the grooves (2); two sides of each groove (2) of the metal radiating piece (1) are provided with LED chip welding points (4) which are electrically connected with the circuit layer; and the LED chip welding points (4) are electrically connected with two electrodes of each LED chip (3) of RGB three primary colors through lead wires (5). According to the invention, the LED chips of RGB three primary colors are packaged in the metal radiating piece, a solidification body of the LED and the metal radiating piece is formed, the radiating steps are reduced, and the lighting effect and color rendering properties of the LED lamp are improved.

Description

technical field [0001] The invention relates to an LED lighting device, in particular to an LED lighting device with high light efficiency and high color rendering. Background technique [0002] The structure of LED lighting is mainly composed of lampshade, metal heat sink, power supply and LED light source. With the advancement of semiconductor industry technology, the cost performance of light-emitting diodes is increasing day by day, and it is the general trend for LED lighting to replace traditional lighting. [0003] At present, the LEDs of all LED lighting lamps on the market are mostly welded on metal substrates (such as aluminum substrates). The heat dissipation path of the entire lighting lamp: LED→PCB board (aluminum substrate)→thermally conductive insulating glue→metal shell→lamp body, although metal substrates such as aluminum substrates have extremely good thermal conductivity and high-strength electrical insulation performance, but the heat dissipation path is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V23/06F21V29/00F21Y101/02F21K9/20F21V29/508F21V29/71F21V29/89F21Y115/10
Inventor 刘东芳
Owner 东莞市远大光电科技有限公司
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