Method for manufacturing inductive element

Abstract

The invention discloses a method for manufacturing an inductive element, comprising the steps of: manufacturing the inductive element by utilizing a die, wherein the die comprises a lower die core and an upper die core; causing the lower die core and the upper die core to relatively move to a filling position and an extrusion position along an axial direction; when the lower die core is located at the filling position, filling an iron silicon alloy material into a first space formed by the lower die core; placing a coil in the iron silicon alloy material in the first space and exposing an extension part of the coil out of the iron silicon alloy material; placing the upper die core at the filling position and filling the iron silicon alloy material into a second space formed by the upper die core to cover the coil body; then moving the upper and lower die cores to the extrusion position to ensure that the iron silicon alloy material is combined with the coil; and solidifying the iron silicon alloy material to ensure that the coil body is fixed in the iron silicon alloy material, wherein high magnetic conductivity is generated by matching the iron silicon alloy material with an integrated structure, the number of turns of the coil is reduced and the cost of the metal material of the coil is low so that the inductive element with low cost, low loss and high magnetic conductivity can be integrated.

Description

technical field [0001] The invention provides a method for manufacturing an inductance element, especially using the lower mold core and the upper mold core to move relatively between the filler position and the extrusion position, so as to manufacture an integrally formed, low-cost inductance element with low loss and high magnetic permeability . Background technique [0002] The inductance element is generally of auxiliary nature, and its main function is to hinder the change of the current to maintain the stability of the electronic product. The form of its structure can be designed in different structures according to different application circuit collocations. At present, the application lines of inductors are mainly divided into two categories, one is for signal purposes, such as energy storage and suppression of instantaneous current applications; the other is for noise suppression purposes, such as electromagnetic interference (Electromagnetic Disturbance, EMI) supp...

AI Technical Summary

Problems solved by technology

On the one hand, wire-wound inductors can use the thickness of the coil to control the current resistance, and on the other hand, the number of coils can be controlled to adjust the inductance value. The product design is more flexible, but its disadvantage is that it is larger

[0005] The current manufacturing method of making inductive components using iron-silicon alloy is to use flake or block-shaped iron-silicon alloy materials to form inductive components by assembling, please refer to Figure 10 , is a side view sectional view of an existing inductance element, and it can be clearly seen from the figure that the inductance element A includes a coil A1, and a sheet-like or block-like iron-silicon alloy material A2 is assembled outside the coil A1, In addition, the inner and outer surfaces of the iron-silicon alloy material A2 are formed with an insulating layer A3, and the assembly method must be processed by dispensing and bonding, which will cause complicated operations and increase costs. On the other hand, the coil A1 is passed through the through hole through the assembly method A11 fits in the iron-silicon alloy material A2, and there will inevitably be a gap A4, so that a larger magnetic path (Le) will be generated around the periphery of the coil A1, and the inner circumference of the through hole A11 of the coil A1 will be affected by the gap A4. The small cross-sectional area causes the coil A1 to cause a large electromagnetic rate loss, and it cannot effectively reduce the thickness and number of turns of the coil, making metal materials increasingly scarce, and the cost of materials that companies need to bear becomes more and more expensive.

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