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Thermoplastic resin laminate

A thermoplastic resin, laminate technology, used in synthetic resin layered products, layered products, transportation and packaging, etc., can solve the problems of imperfect performance, strong water absorption, and lack of heat resistance of methacrylic resin layers , to achieve the effect of good interlayer adhesion

Inactive Publication Date: 2011-07-27
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the methacrylic resin layer lacks heat resistance and deforms in a high-temperature environment, and has problems such as bending due to humidity changes due to strong water absorption.
[0005] In addition, as a resin that has good transparency and is used in optical components, Patent Document 3 discloses a resin in which a (meth)acrylate monomer and an aromatic vinyl monomer are polymerized and hydrogenated. further improvement

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0065] Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to these Examples.

[0066] Evaluation of the thermoplastic resin laminates obtained in Examples and Comparative Examples was performed as follows.

[0067]

[0068] The test piece was cut into 10 cm x 10 cm, and pressed on a cylinder with a diameter of 60 mm so that the (A) layer was on the outside, and the interlayer adhesion was evaluated. No change in appearance is considered good.

[0069]

[0070] The test piece was cut into a square with a side length of 10 cm. In a constant temperature and humidity chamber with a set temperature of 85° C. and a relative humidity of 85%, the test piece was suspended using the corner of the test piece as a fulcrum, and kept in this state for 72 hours. The test piece was taken out, and the presence or absence of a change in appearance was evaluated. No change in appearance is considered good. ...

Synthetic example 1

[0073] Synthesis Example 1 [Preparation of methyl methacrylate-styrene-vinylcyclohexane copolymer resin (resin A2)]

[0074] 60.0188 mol% methyl methacrylate and 39.9791 mol% styrene as a monomer component, 0.0021 mol % of 2,3,6-trichlorobenzoic acid (t-Amilpa-Okishi-2-エチルヘキサノエト) formed a monomer composition, the average residence time is 2.5 hours, the polymerization temperature is 150 ° C under continuous polymerization. In order to keep the liquid level of the polymerization tank constant, the reaction solution was continuously extracted from the bottom, and introduced into a desolventizing device to obtain granular methyl methacrylate-styrene copolymer resin (resin A1).

[0075] The obtained resin A1 was dissolved in methyl isobutyrate to prepare a 10% by weight methyl isobutyrate solution. In the autoclave device of 1000mL, add the 10% by weight methyl isobutyrate solution of 500% by weight of resin A1, the 10% by weight of Pd / C catalyst of 1% by weight, be 10MPa, keep ...

Embodiment 1

[0077] A single-screw extruder with a shaft diameter of 25 mm, a single-screw extruder with a shaft diameter of 35 mm, a single-screw extruder with a shaft diameter of 65 mm, a feed sleeve connected to all extruders, and a A multi-layer extrusion device with a T-die connected to a material sleeve forms a thermoplastic resin laminate. Methyl methacrylate-styrene (3:7) copolymer resin [manufactured by Nippon Steel Chemical Co., Ltd., trade name: Eschinen MS300] (resin B1) was continuously introduced into a single-screw extruder with a shaft diameter of 25 mm. , extruded at a cylinder temperature of 240°C and a discharge rate of 0.5kg / h. In addition, the vinyl copolymer resin (resin A2) obtained in Synthesis Example 1 was continuously introduced into a single-screw extruder with a shaft diameter of 35 mm, and extruded at a cylinder temperature of 250° C. and a discharge rate of 3 kg / h. In addition, the polycarbonate resin Upiron E-2000 (resin C) manufactured by Mitsubishi Engine...

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Abstract

The present invention provides a thermoplastic resin laminate including: a thermoplastic transparent resin (A) layer; a thermoplastic resin (B) layer formed of a methyl methacrylate-styrene copolymer and / or an acrylonitrile-styrene copolymer; and a thermoplastic resin (C) layer formed of a polycarbonate-based resin, the (B) layer being laminated on one surface, or each of both surfaces, of the (C) layer, and the (A) layer being laminated on the surface of the (B) layer, in which the thermoplastic transparent resin (A) includes a vinyl copolymer resin containing a (meth)acrylate constituent unit (a) and an aliphatic vinyl constituent unit (b) each having a specific structure at a molar ratio between the (meth)acrylate constituent unit (a) and the aliphatic vinyl constituent unit (b) of 15:85 to 85:15. The thermoplastic resin laminate has such characteristics as to be excellent in, for example, weather resistance against high-temperature, high-humidity environments, abrasion resistance, and interlayer adhesion, and is used, as a transparent substrate material or a transparent protective material, for an optical product, and in particular, portable display devices such as portable phone terminals, portable electronic game devices, and PDA's.

Description

technical field [0001] The present invention relates to a thermoplastic resin laminate, and more particularly to a thermoplastic resin laminate having good weather resistance, scratch resistance, interlayer adhesion, etc. for a substrate material or protective material used for transparency, in a high-temperature and high-humidity environment body. Background technique [0002] Resin transparent boards are used in various fields such as soundproof walls, carports, signboards, or display front panels of OA (Office Automation) machines and portable electronic devices. In particular, portable display devices such as mobile phone terminals, portable electronic game consoles, and PDAs are more and more required to ensure that their front panels are relatively stable against high-temperature and high-humidity environments from the perspective of functionality for users to carry and walk in various environments. Improvement of weather resistance, scratch resistance, interlayer adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/30B32B27/36C08F210/00C08F220/12
CPCC08F212/08B32B7/12B32B27/08B32B27/36C08F8/04B32B27/30Y10T428/31507C08F220/14C08F210/00
Inventor 小黑宽树小池信行三枝畅也青木俊成
Owner MITSUBISHI GAS CHEM CO INC
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