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Metal suction end for assembling laser diode

A technology of laser diodes and metals, applied in lasers, laser parts, semiconductor lasers, etc., can solve the problems of easy aging of rubber materials, difficulty in making heads, short service life, etc., achieve long service life, reduce surface pressure, Good observation effect

Inactive Publication Date: 2011-08-03
大连艾科科技开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the rubber frustum-shaped head can relieve the pressure on the chip, the temperature of the ordinary rubber material is relatively low, and the price of the special high-temperature rubber is relatively high; the rubber material is easy to age and has a short service life; department

Method used

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  • Metal suction end for assembling laser diode
  • Metal suction end for assembling laser diode
  • Metal suction end for assembling laser diode

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Embodiment Construction

[0011] The specific implementation manner of the present invention will be described below with reference to the accompanying drawings. Such as figure 1 , 2 Shown in , 3: the same as the prior art, there is a metal cylinder 1, there is a suction hole 2 at the axis of the metal cylinder 1, and the front end of the metal cylinder 1 is a frustum-shaped head 3, which is different from the prior art It is a metal with an integrated structure of the frustum-shaped head 3 and the metal cylinder 1. On the frustum-shaped head 3, there are two wedge surfaces 4 arranged symmetrically along the axis. Front V-groove 5. In order to further improve the absorption performance, the opening angle of the V-shaped groove 5 is 120°-150°. The metal cylinder 1 and the frustum-shaped head 3 are preferably made of tungsten steel, which can withstand the temperature requirement of 300°C to 800°C.

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PUM

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Abstract

The invention discloses a metal suction end for assembling a laser diode, which has the advantages of favorable observation sight line under a microscope, capability of reducing chip surface pressure, high-temperature resistance, low cost and long service life. The metal suction head comprises a metal cylinder (1), a suction hole (2) is arranged in the axle center of the metal cylinder (1), the front end of the metal cylinder (1) is a truncated-cone-shaped head part (3) which is in an integral structure with the metal cylinder (1), the truncated-cone-shaped head part (3) is provided with two wedged faces (4) symmetrical along an axis, and a V-shaped slot (5) with a forward opening is arranged in a center of the front end face of the truncated-cone-shaped head part (3).

Description

Technical field: [0001] The invention relates to a suction head for assembling laser diodes, in particular to a metal suction head for assembling laser diodes which has a good observation line of sight under a microscope, can reduce chip surface pressure, is resistant to high temperatures, has low cost, and has a long service life. Background technique: [0002] Laser diodes are different from ordinary semiconductor chip assembly in the following ways: because the material used in laser diodes is brittle indium phosphide and the surface of the laser diode has a light-emitting structure, it cannot withstand greater pressure during assembly; the laser diode chip is directional , high precision is required for assembly; in order to ensure good heat dissipation performance of the laser diode, gold-tin solder with high temperature is used for assembly. For this reason, the structure of the suction head used when assembling the laser diode is to have a metal cylinder at present, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00
Inventor 刘学洋
Owner 大连艾科科技开发有限公司
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