Semiconductor chip and method for forming conductive pillar

Abstract

The invention provides a semiconductor chip and a method for forming a conductive pillar. A semiconductor chip has a first portion inside the metal contact opening and a second portion overlying the passivation layer. The second portion of the bond pad has a first width. A buffer layer over the bond pad has a pillar contact opening with a second width to expose a portion of the bond pad. A conductive pillar has a first portion inside the pillar contact opening and a second portion over the buffer layer. The second portion of the conductive pillar has a third width. A ratio of the second widthto the first width is between about 0.35 and about 0.65. A ratio of the second width to the third width is between about 0.35 and about 0.65.

Description

technical field [0001] The present invention relates to a semiconductor bump manufacturing process, in particular to a structure and method for forming a conductor stud bump. Background technique [0002] Flip chip technology plays a very important role in the packaging process of semiconductor devices. Flip-chip microelectronic assembly involves electrically connecting flip-chip electronic components directly to a substrate, such as a circuit board, using solder bumps as connections. The use of flip-chip packaging has grown dramatically due to its size, performance, and adaptability advantages over other packaging methods. [0003] Conductor post technology has come a long way in recent years. Instead of using solder bumps, copper pillars are used to connect electronic components to the substrate. Copper pillar technology enables finer pitches with less potential for bump bridging, reducing capacitive loading of circuits and allowing electronic components to operate at h...

AI Technical Summary

Problems solved by technology

Cracks can damage or destroy electronic components, which increases the reject rate of the entire assembly

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