Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micromechanical component and method for the production thereof

A technology of micromechanical components and structures, applied in the field of manufacturing such components, can solve the problems of escaping gas, changing pressure, etc.

Active Publication Date: 2011-08-24
ROBERT BOSCH GMBH
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the problem is that the remainder of the solvent may remain in the sealing glass, and thus in the cavity gas escapes and changes the predetermined pressure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micromechanical component and method for the production thereof
  • Micromechanical component and method for the production thereof
  • Micromechanical component and method for the production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] the following Figures 1 to 7 The production of a micromechanical component 300 is shown schematically, which can be used, for example, as an inertial sensor in a motor vehicle. During manufacture, processes and materials conventional in semiconductor technology can be used.

[0017] figure 1 and 2 The production of a functional substrate 100 with a micromechanical structure or MEMS structure 150 is shown for a component 300 , initially a substrate 100 is provided, which comprises, for example, a semiconductor material such as silicon. Substrate 100 may be a commonly used wafer having a diameter of, for example, 8 inches (200 mm).

[0018] Next on the substrate 100 as in figure 1 A sacrificial layer (Opferschicht) 110 is applied as shown in and a functional layer 120 is applied on this sacrificial layer 110 . The sacrificial layer 110 preferably comprises silicon oxide. The functional layer 120 may be a so-called epitaxial polysilicon layer, ie a polysilicon laye...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for producing a micromechanical component (300) that comprises providing a first substrate (100), forming a microstructure (150) on the first substrate (100), wherein the microstructure (150) comprises a moving function element (151), providing a second substrate (200), and forming in the second substrate (200) an electrode (251) for capacitively measuring a deflection of the function element (151). The method further comprises connecting the first and the second substrates (100; 200), wherein a closed cavity which encloses the function element (151) is formed, and wherein the electrode (251) adjoins the cavity in an area of the function element (151).

Description

technical field [0001] The invention relates to a micromechanical component comprising a first substrate and a second substrate connected to the first substrate, wherein the first substrate has a microstructure with movable functional elements, and the first and The second substrate is interconnected in such a way that the functional element is surrounded by the cavity. The invention also relates to a method for producing such a component. Background technique [0002] Micromechanical components are used, for example, in the automotive sector as inertial sensors or acceleration sensors, usually having a microstructure with movable functional elements. Microstructures are also referred to as MEMS structures (Micro Electro Mechanical Systems). During sensor operation, a deflection of the functional element is detected, for example, by a change in capacitance relative to a fixed reference electrode. [0003] The usual methods for producing micromechanical components consist ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81B7/007B81B2201/033B81C2203/036B81C2203/0118B81B2207/095Y10T29/49126
Inventor A·法伊
Owner ROBERT BOSCH GMBH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com