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Manufacturing method of two-layer single-sided flexible copper clad laminate

A technology of flexible copper clad laminates and manufacturing methods, which is applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., which can solve the problem of plate warping, affect the pass rate of FPC processing, reduce the breakdown voltage of PI film, etc. problems, to achieve the effect of increasing surface roughness, maintaining breakdown voltage, and simple operation

Active Publication Date: 2011-08-31
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the application of two-layer single-sided flexible copper-clad laminates, the problem of warping after etching is prone to occur, which affects the processing pass rate of FPC.
Adding fillers in the formulation can increase the roughness of the PI film, but at the same time reduce the breakdown voltage of the PI film

Method used

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  • Manufacturing method of two-layer single-sided flexible copper clad laminate
  • Manufacturing method of two-layer single-sided flexible copper clad laminate
  • Manufacturing method of two-layer single-sided flexible copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0054] Weigh 6.5058g of 4,4'-ODA and 16.0058g of PPDA, dissolve in a mixed solvent of 180g DMAc and 180gNMP while stirring in a 1000ml three-necked flask, then add 1.24 g of 2MZ-A, 34.3281 g of BPDA and 13.7034 g of PMDA were continuously stirred for 4 hours to perform a polymerization reaction to obtain a polyamic acid solution.

Synthetic example 2

[0056] Weigh 7.2287g of 4,4'-ODA and 15.6154g of PPDA, and add them into a 1000ml three-necked flask while stirring, and dissolve them in a mixed solvent of 180g DMAc and 180gNMP. While stirring, 52.4447g of BPDA was added, and the stirring was continued for 4 hours to carry out polymerization reaction to obtain a polyamic acid solution.

Synthetic example 3

[0058] Weigh 3.99g SiO2 2 , add in the mixed solvent of 180g NMP and 180gDMAC, disperse with ultrasonic wave for 5 minutes, then add this predispersed solution in the three-neck flask of 1000ml, weigh 7.2287g of 4,4'-ODA and 15.6154g of PPDA, In the case of a three-necked flask, after dissolving completely, add 52.4447g of BPDA under nitrogen gas and stirring, and continue to stir for 4 hours to carry out polymerization reaction to obtain SiO 2 5% polyamic acid solution.

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Abstract

The invention relates to a manufacturing method of a two-layer single-sided flexible copper clad laminate. The method comprises the following steps: providing copper foil and preparing a polyamic acid solution with filling materials and a polyamic acid solution without filling materials; coating the copper foil with the polyamic acid solution without filling materials and pre-baking the copper foil at a temperature of 100 to 200 DEG C to form a polyamic acid coating without filling materials; coating the polyamic acid coating without filling materials with the polyamic acid solution with filling materials and pre-baking at a temperature of 100 to 200 DEG C to form a polyamic acid coating with filling materials; placing the copper foil successively coated with the polyamic acid coating without filling materials and the polyamic acid coating with filling materials into a nitrogen high-temperature baking oven for high-temperature imidization and finally to obtain the two-layer single-sided flexible copper clad laminate. The invention is simple in operation. The two-layer single-sided flexible copper clad laminate prepared by two times of coating is flat and smooth instead of warping before and after etching.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a method for manufacturing single-sided flexible copper-clad laminates by a two-layer method. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Due to the continuous improvement of technical requirements in the electronics industry, consumer electronics products are rapidly becoming thinner and smaller The corresponding flexible copper clad laminates are required to be lighter and thinner and have high heat resistance and high reliability. The two-layer flexible copper clad laminate has achieved rapid development in recent years due to the use of polyimide resin with excellent mechanical properties, electrical properties and heat resistance. [0003] During the application process of the two-layer single-sided flexible...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/095B32B15/20B32B27/18
Inventor 梁立伍宏奎茹敬宏张翔宇
Owner GUANGDONG SHENGYI SCI TECH
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