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Method and apparatus for thermally processing plastic sheets, especially shaped wafers

A technology for thermal processing and forming of wafers, used in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., to solve problems such as impossible to form wafer handling and processing, poor thermal conductivity, etc.

Active Publication Date: 2014-10-15
ERS ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the poor thermal conductivity of the plastic used to form the wafer, and the interaction with the embedded silicon chip, which has a different coefficient of thermal expansion, this cooling leads to freezing stresses in the transition region UB, resulting in bowing (warpage) of the forming wafer, This makes subsequent handling and processing of the formed wafer more difficult or impossible

Method used

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  • Method and apparatus for thermally processing plastic sheets, especially shaped wafers
  • Method and apparatus for thermally processing plastic sheets, especially shaped wafers
  • Method and apparatus for thermally processing plastic sheets, especially shaped wafers

Examples

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Embodiment Construction

[0033] Figure 1a , b shows a schematic diagram of an apparatus for thermal lamination of molded wafers as a first embodiment of the present invention, specifically, Figure 1a is the side view, Figure 1b is the top plan view.

[0034] Figure 1a , b, reference numeral 1 denotes a bottom platform, which is made of, for example, aluminum. A display platform 3 having an upper surface O' is attached to the platform 1 by a support 3a. The display platform 3 is heated and, in the case of this example, with Figure 9 Consistent with the example, heating at temperature T1 = 100°C. Reference numeral 15 denotes a molded wafer, into which a silicon chip 15 a is embedded by a known method, one surface of the silicon chip 15 a being flush with the upper side of the molded wafer 15 . A carrier substrate 17, such as steel, is bonded to the molded wafer by means of a thermally separable membrane 16, which is the end result of the fabrication process of the molded wafer, in which silico...

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Abstract

A method and apparatus for thermally processing mold wafers The method comprises: clamping a mold wafer at a first temperature on a first clamping device, the first temperature being below the hardening temperature of the plastic of the mold wafer; heating the mold wafer to a second temperature, which is higher than the first temperature and is above the hardening temperature; ending the clamping on the first clamping device and transporting the mold wafer heated to the second temperature to a second clamping device substantially contactlessly; clamping the heated mold wafer on the second clamping device; cooling the mold wafer down to a third temperature, which is lower than the second temperature and is below the hardening temperature; and ending the clamping on the second clamping device.

Description

technical field [0001] The present invention relates to methods and apparatus for thermally processing plastic sheets, in particular shaped wafers, also known as molded wafers, composite wafers or epoxy wafers, herein referred to throughout as shaped wafers. Background technique [0002] Although the invention and the problems solved by the invention are described below on the basis of shaped wafers, the invention is not limited thereto but is generally applicable to thin plastic sheets. [0003] In semiconductor technology there has been an increasing use of so-called molded wafers in recent years, in which individual silicon chips are embedded at a distance from one another in a molded compound which itself has the shape of a wafer and which, for example in The molding compound surface sits in place. [0004] During the preparation of the shaped wafer, thermal processing is required of the shaped wafer assembly, which includes a thermally separable membrane, and a carrier...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
CPCH01L21/67109H01L21/6838H01L21/67784H01L21/324H01L21/67098
Inventor 埃里希·赖廷格
Owner ERS ELECTRONICS