Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same

A technology of synthetic fibers and prepregs, applied in printed circuits, printed circuits, printed circuit components, etc., can solve problems such as unstable bonding of fiber paper and substrate size changes, and achieve good processing performance, high temperature resistance, and thermal stability Good results

Inactive Publication Date: 2011-09-07
深圳昊天龙邦复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] When used as the basic material of circuit substrates, synthetic fiber paper needs to withstand heat and pressure during the lamination process. In the composition of synthetic fiber paper, the choice of bonding fibers has a greater impact on the various properties of the paper. , For example, the glass transition temperature (Tg) of aramid fiber paper with resin as binder is much lower than that of para-aramid fiber, when the prepreg of fiber paper is used as the basis of circuit board When the materials are laminated under heat and pressure, the resin binder will re-melt, resulting in an unstable bond of the fiber paper, causing significant dimensional changes in the laminated substrates

Method used

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  • Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same
  • Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same
  • Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Prepare the present embodiment 1 synthetic fiber paper in the following proportions:

[0037] Aramid 1414 fiber (5-6mm) 80 parts by weight (hereinafter referred to as "parts")

[0038] Aramid 1414 precipitated fiber 20 parts

[0039]The aramid 1414 fiber with the above content is decomposed into pulp A at a concentration of 1% by weight in a hydropulper, and the 1414 precipitated fiber is decomposed in a hydropulper at a concentration of 2%, and the beating degree is controlled by grinding and beating About 75° SR, make slurry B. After the slurry A and the slurry B are uniformly mixed in the batching tank to form papermaking pulp that can be added to the headbox of the papermaking wire, 5 parts of polyethylene oxide are added to the pulp stabilization box. The head of the slurry on the net is adjusted by the stock stabilizing box, and the slurry is evenly distributed on the paper forming wire in the headbox, and the excess slurry is overflowed to the white water pool....

Embodiment 2

[0043] Prepare the present embodiment 2 fiber papers in the following proportions:

[0044] Aramid 1414 fiber (5 ~ 6mm) 20 parts

[0045] Aramid 1414 precipitated fiber 80 parts

[0046] This embodiment adjusts the consumption of aramid 1414 fiber and fibrid, the preparation method of fiber paper is the same as that of Example 1, and the results obtained are shown in Table 2:

[0047] Table 2 Physical and mechanical properties of fiber paper

[0048]

[0049]

Embodiment 3

[0051] Prepare the present embodiment 3 fiber papers in the following proportions:

[0052] Aramid 1414 fiber (5 ~ 6mm) 70 parts

[0053] Aramid 1414 precipitated fiber 30 parts

[0054] This embodiment adjusts the consumption of aramid 1414 fiber and fibrid, the preparation method of fiber paper is the same as that of Example 1, and the results obtained are shown in Table 3:

[0055] Table 3 Physical and mechanical properties of fiber paper

[0056]

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Abstract

The invention relates to a prepreg manufactured from aromatic synthetic fiber paper used as a printed circuit board, and a copper clad board as well as printed circuit board manufactured from the prepreg. The synthetic fiber paper used as the base material of the base board of the circuit board is manufactured from the following materials in percentage by weight: 10-90% of structural fiber (para-position aramid fiber) and 90-10% of tacky fiber (para-position aramid fibrid or pulp). In the invention, the base board of the circuit board and the printed circuit board using the synthetic fiber paper as the base material have the advantages of light weight, good temperature tolerance, high thermal stability and fine processability.

Description

technical field [0001] The present invention relates to an aromatic synthetic fiber paper used as a printed circuit board and a prepreg made of it, in particular to a prepreg made of at least one layer of aromatic synthetic fiber paper. [0002] The invention also relates to a copper clad laminate and a printed circuit board made of the prepreg. Background technique [0003] PCB, or Printed Circuit Board, refers to a printed circuit board (or printed circuit board), which is a printed board that forms point-to-point connections and printed components on a common substrate according to a predetermined design. The printed circuit board is made of a reinforcing material impregnated with a resin and dried to make a prepreg. The prepreg is made into a copper-clad laminate (substrate) of different thicknesses as required, and then the copper-clad laminate is used to make one or more layers of printed circuit boards. Printed circuit boards are essential accessories in modern elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H13/26D21H19/14H05K1/03
CPCD21H19/04D21H17/55D21H17/52D21H13/26D21H17/56D21H19/02H05K2201/0278D21H19/14H05K1/0366D21H17/63Y10T428/269Y10T428/24917
Inventor 陶世毅衡沛之
Owner 深圳昊天龙邦复合材料有限公司
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