Method for measuring accumulated thickness of MOS (metal oxide semiconductor) tube gate oxide layer

A technology of gate oxide layer and accumulated thickness, which is used in electrical/magnetic thickness measurement, electromagnetic measurement device, semiconductor/solid-state device testing/measurement, etc. The effect of accurate thickness value and accurate capacitance value

Inactive Publication Date: 2011-09-07
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] To sum up, the method for measuring the thickness of the gate oxide layer of MOS transistors in the prior art has the disadvantage that it is not suitable for the measurement of the gate oxide layer of MOS transistors with a thinner thickness.

Method used

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Embodiment Construction

[0013] The method for measuring the cumulative thickness of the gate oxide layer of the MOS transistor of the present invention comprises the following steps:

[0014] S1, adjusting the test voltage to make it close to the breakdown voltage between the gate and the substrate;

[0015] S2, measuring the capacitance value of the gate oxide layer according to the test voltage described in S1;

[0016] S3, calculating the accumulated thickness of the gate oxide layer according to the capacitance value described in S2.

[0017] The formula for calculating the cumulative thickness of the gate oxide layer of the MOS transistor is Tox=ε×ε 0 ×A / Cox. In the calculation formula, Tox is the cumulative thickness of the gate oxide layer, Cox is the capacitance value of the gate oxide layer, ε is the vacuum dielectric constant, ε0 is the SiO2 dielectric constant, and A is the capacitance area.

[0018] Preferably, a capacitance tester is used to measure the capacitance value of the gate o...

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Abstract

The invention discloses a method for measuring the accumulated thickness of an MOS (metal oxide semiconductor) tube gate oxide layer, comprising the following steps: S1, regulating a test voltage to be close to a breakdown voltage between a grid and a substrate; S2, measuring the capacitance of a gate oxide layer in accordance with the test voltage in the S1; and S3, calculating the accumulated thickness of the gate oxide layer in accordance with the capacitance in the S2. The calculation formula of the accumulated thickness of the gate oxide layer is as follows: Tox=epsilon*epsilon0*A / Cox, wherein Tox represents the accumulated thickness of the gate oxide layer, Cox represents the capacitance of the gate oxide layer, epsilon represents a vacuum permittivity, epsilon0 represents a dielectric constant and A represents a capacitance area. The method provided by the invention is applied to measuring the thinner MOS tube gate oxide layers.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for measuring the cumulative thickness of a gate oxide layer of a MOS transistor. Background technique [0002] In the field of semiconductor manufacturing technology, finished semiconductor devices include many basic devices such as MOS transistors. In order to grasp the process parameters of MOS, it is necessary to measure the accumulated thickness of the gate oxide layer of MOS transistors. In the prior art, the method for measuring the thickness of the MOS tube gate oxide layer accumulation is: (1), according to the power supply voltage is ±Vdd, measure the capacitance value Cox of the MOS tube gate oxide layer; (2), calculate the capacitance value Cox of the MOS tube according to the capacitance value Cox The cumulative thickness of the gate oxide layer. Among them, the NMOS tube is +Vdd, and the PMOS tube is -Vdd. The formula for calculating t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01R31/26G01B7/06
Inventor 韦敏侠
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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