Micro electromechanical device and manufacturing method thereof

Abstract

The invention provides a micro electromechanical device and a manufacturing method thereof. The manufacturing method comprises the following steps of: providing a base plate and a semiconductor substrate, wherein a control circuit is formed on the semiconductor substrate; forming a base plate sacrificial layer on the base plate; forming a semiconductor material layer on the base plate sacrificiallayer; forming an interlayer dielectric layer covering the control circuit on the semiconductor substrate, wherein an interconnection structure electrically connected with the control circuit is formed on the interlayer dielectric layer; performing a bonding process to bond the interlayer dielectric layer and the semiconductor material layer together; removing the base plate sacrificial layer, and separating the base plate and the semiconductor material layer; and manufacturing the micro electromechanical device electrically connected with the interconnection structure on the semiconductor substrate by using the semiconductor material layer. The embodiment of the invention improves the integration level of the micro electromechanical device to meet the requirement on portability in application.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, in particular to micro-electromechanical devices and manufacturing methods thereof. Background technique [0002] MEMS (Micro Electro Mechanical System) technology refers to the technology of designing, processing, manufacturing, measuring and controlling micro / nano (micro / nanotechnology) materials. MEMS is a micro system that integrates mechanical components, optical systems, drive components, and electronic control systems into an integral unit. MEMS technology is generally applied in the manufacture of micro-electro-mechanical devices, which include: position sensors, rotation devices, or inertial sensors, such as acceleration sensors, gyroscopes, and sound sensors. [0003] The prior art utilizes MEMS technology to fabricate a micro-electromechanical device on a semiconductor substrate, then utilizes CMOS technology to fabricate a control circuit on another semic...

AI Technical Summary

Problems solved by technology

Usually, the semiconductor substrate containing the control circuit and the semiconductor substrate on which the MEMS devices are formed are arranged side by side in the lead frame. Therefore, the existing MEMS devices have a large volume, so the integration degree of the MEMS devices is not high. , unable to meet the requirements of portability in the application

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