Light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package

A technology for LED chips and outdoor products, applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of complexity, poor assembly precision, and many process steps, and achieve the effects of improving quality, reducing production costs, and improving production efficiency

Inactive Publication Date: 2011-09-14
深圳市格特隆光电股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to enhance heat conduction, LED lamp welding PCB boards usually use aluminum substrates to transfer heat to metal structural parts, and then the structural parts and the product shell are fixed into a whole product and the heat is conducted outward. The process described above is complicated and complicated. The post-a

Method used

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Example Embodiment

[0021] The present invention will be described in detail below in conjunction with embodiments:

[0022] The LED outdoor product chip integrated package light emitting, heat dissipation and wiring process of the present invention is characterized in that it includes the following technical steps:

[0023] 1). Design the LED chip PCB wiring board according to the needs, using silver or gold plating to ensure the LED chip lead gold wire ball bonding or aluminum wire bonding wire needs;

[0024] 2) Design the LED reflector bracket according to the needs and stamp the copper material by the bracket mold to form a conjoined bracket that can be used. The bracket adopts a micro-cutting process. After the bracket is installed into the PCB or broken after injection, the connection part is not required ;

[0025] 3) Design reflective plastic cups and adhesive layers according to the needs of light-emitting products, and design plastic molds according to the requirements of fixing the PCB and br...

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PUM

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Abstract

The invention discloses a light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package. A light-emitting LED chip integrated package product can be manufactured by designing an LED chip printed circuit board (PCB) wiring board, designing an LED chip light-reflecting cup bracket, manufacturing a silver-plated bracket through a bracket die, loading the silver-plated bracket into the LED chip PCB wiring board, designing a light-reflecting cup according to needs of the product, performing injection molding on a PCB, the bracket and a rubber cup to form the PCB, the wiring plate, the bracket and the rubber cup into a whole through a light-reflecting cup rubber die, and performing LED crystal fixation, routing and spot gluing process steps. In a packaging process, new light-emitting, radiating and wiring process technologies are adopted; the light-emitting efficiency and the radiating property of the product are improved; the quality and the efficiency of the product are improved; and the requirement of mass production is better met.

Description

Technical field [0001] The invention relates to an LED outdoor product chip integrated packaging process for light emission, heat dissipation and wiring. Background technique [0002] Existing LED outdoor lighting and display products basically adopt the collective application method of multiple LED light-emitting lamps. This method uses the existing LED single lamp packaging process to make a single lamp, and then the LED single lamp adopts a surface mount welding process Or the plug-in soldering process is soldered on the wired PCB board. In order to enhance heat conduction, LED lamp welding PCB boards mostly use aluminum substrates to transfer heat to metal structural parts, and then the structural parts and the product shell are solidified into a product and the heat is transmitted outwards. This kind of process has many and complicated processes. The later assembly requires a large amount of manual work, poor assembly accuracy, and limited space for quality improvement and ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/62H01L33/64H01L25/075
Inventor 刘振亮
Owner 深圳市格特隆光电股份有限公司
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