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Laser processing device and laser processing method

A laser processing method and laser processing technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as cracks and divisions, and achieve stable processing effects

Inactive Publication Date: 2011-09-21
MITSUBISHI MATERIALS CORP
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  • Abstract
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  • Claims
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Problems solved by technology

[0007] That is, when using the conventional method, that is, the method of scribing and cutting the line groove by irradiating laser light and scanning repeatedly, there is also a problem that, due to the influence of heat or the dispersion of impurities in the process of processing, the scribing process is not carried out. Cracks in the expected direction resulting in splits

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  • Laser processing device and laser processing method
  • Laser processing device and laser processing method
  • Laser processing device and laser processing method

Examples

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Embodiment 1

[0053] Next, examples at the time of actual processing will be specifically described based on the laser processing apparatus and the laser processing method according to the present invention.

[0054] In this example, a ceramic sintered body (thickness: 250 μm) was processed as an object to be processed with laser light having a wavelength of 355 nm using the laser processing apparatus of this embodiment. At this time, a polyimide resin film (thickness 0.1 mm) was bonded to the surface of the ceramic sintered body as a resin film with an acrylic adhesive, and an aluminum film (thickness 0.05 mm) was used as a metal film with a silicone adhesive. The film is glued to the back. The object to be processed in this state is attracted to the mounting jig.

[0055] The output of the laser is set to 1.3W, the repetition frequency H is set to 125kHz, and the beam point is measured. The result is that the beam diameter is 20μm, so the scanning speed S is set to 3750mm / sec, and the sc...

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Abstract

The invention discloses a laser processing device and a laser processing method, for processing in the process of cutting fragile material having high residual stress without crack and the like. A device for processing by irradiating laser to an object to be processed comprises a laser irradiation mechanism. The pulse oscillation laser of the laser irradiation mechanism irradiates the object to be processed in a certain repetitive frequency while scanning. The repetitive frequency is H. The beam diameter of the laser is a. The scanning time of the laser on the same processing line is n. When the displacement distance L by irradiating pulse laser for one time is n / 2*a, the laser irradiation mechanism sets the laser scanning speed S as L / (1 / H); the irradiation start position of the laser whose scanning time is 1 is L1; the irradiation start position Ln of the laser whose scanning time is n is L1+(L / n)*(n-1); therefore, the laser irradiation mechanism irradiates laser by shifting the irradiation start position in the event of scanning each time.

Description

technical field [0001] The present invention relates to a laser processing device and a laser processing method suitable for, for example, cutting processing of brittle materials. Background technique [0002] Usually, in the cutting process of brittle materials such as fired ceramic chips, mechanical methods such as grinding with a whetstone are used for shaping. However, since fired ceramic sheets and the like generate high residual stress inside by sintering, the residual stress increases especially as the thickness of the substrate becomes thinner, and it is difficult to process without cracks at the beginning of processing. [0003] In addition, there is also known a method of performing processing such as dicing by irradiating a fired ceramic sheet or the like with laser light and repeating scanning in order to obtain desired processing properties. For example, conventionally, Patent Document 1 describes a method for cutting a brittle material in which a strip made of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/18B23K26/42B23K26/00B23K26/38
Inventor 高桥正训日向野哲
Owner MITSUBISHI MATERIALS CORP
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