Adhesive tape

An adhesive tape and adhesive layer technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc. , adhesive composition exposure, etc.

Inactive Publication Date: 2011-09-21
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in conventional adhesive tapes containing fine air bubbles and hollow inorganic particles in the adhesive layer, the workability of winding the adhesive tape was not taken into consideration.
As a result, when the adhesive tape, which generally has a length of several meters to several hundreds of meters, is wound into a roll, there is a problem that it is difficult to wind due to the rebound force when the portion inside the roll structure is hard.
On the contrary, in the case where the part on the outside of the roll structure is relatively hard, there is a problem that the adhesive composition is exposed due to excess force exerted on the inside part.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0136] Into a mixture of 90 parts by weight of 2-ethylhexyl acrylate and 10 parts by weight of acrylic acid as monomer components, 0.05 parts by weight of the trade name "Irgacure 651" (manufactured by Ciba Specialty Chemicals) and the trade name " Irgacure 184 " (manufactured by Ciba Specialty Chemicals Co., Ltd.) 0.05 parts by weight as a photopolymerization initiator, then irradiated with ultraviolet rays until the viscosity (using a BH type viscometer, No. 5 rotor, measured at 10 rpm and a measurement temperature of 30° C.) was about 15 Pa·s, thereby making a partially polymerized composition (prepolymer). 0.08 parts by weight of 1,6-hexanediol diacrylate was added to 100 parts by weight of the prepolymer. Further, 5.5 parts by weight of a product name "Q-CEL 5020" (manufactured by Pottazu Baroteini Co., Ltd.) was added to the prepolymer as hollow glass microspheres. In addition, 1 part by weight of the trade name "Surflon S-393" (manufactured by Sei Chemical Co., Ltd.; a...

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Abstract

An adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, a bubble, and a hollow inorganic fine particle. When a pinhole region is present in the pressure-sensitive adhesive layer where the light that has been radiated onto one surface of the pressure-sensitive adhesive layer is transmitted through the pressure-sensitive adhesive layer up to the other surface thereof, and when the pressure-sensitive adhesive tape is bisected with a line intersecting the longitudinal direction of the tape at right angles, 60% or more of large pinhole regions each having a diameter of 1.5 mm or more are present in either of the two portions. Thereby, when the pressure-sensitive adhesive tape is to be wound, the tape can be easily wound or it can be suppressed that the pressure-sensitive adhesive composition may be forced out.

Description

technical field [0001] This invention relates to adhesive tapes. Background technique [0002] In the case of bonding curved surfaces or uneven surfaces that require cohesive strength, processability, resilience resistance, etc., pressure-sensitive adhesive (adhesive) tapes that have a pressure-sensitive adhesive layer (adhesive layer) and a substrate are often used . [0003] In order to improve the initial adhesive force or adhesiveness to rough surfaces or reduce the amount of adhesive used to reduce costs, the adhesive layer of the adhesive tape with the pressure-sensitive adhesive layer and the substrate sometimes contains tiny air bubbles . For example, a method of dispersing air bubbles in an adhesive layer is known (Patent Document 1). [0004] In addition, hollow inorganic fine particles may be contained in an adhesive layer of an adhesive tape having a pressure-sensitive adhesive layer and a substrate in order to reduce the weight of the adhesive tape, improve w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/02C09J11/04
CPCC09J11/04C09J7/0217C09J2205/11C09J2433/00C09J2205/102C09J7/385C09J2301/408C09J2301/412Y10T428/24273
Inventor 小川拓磨椿裕行井口伸儿小阪德寿广濑彻哉
Owner NITTO DENKO CORP
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