Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermosetting adhesive for flexible basic material and preparation method thereof

A flexible substrate, thermosetting adhesive technology, applied in the direction of adhesives, epoxy resin glue, printed circuit manufacturing, etc., can solve the problems of complex process and high cost, and achieve the effect of excellent flexural resistance

Active Publication Date: 2011-09-21
SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
View PDF9 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The two-layer method FCCL is commonly prepared by three methods: coating method, lamination method and sputtering method. It has excellent performance, but the process is complicated and the cost is high; (Polyimide film or polyester film) and adhesive three-layer composite, in which insulating base film and copper foil are available in the market, so the adhesive becomes a three-layer flexible copper clad laminate (3L-FCCL) manufacturing technology key components of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Preparation of prepolymer (each component is configured in parts by weight): put 20 parts of BMI, 10 parts of DDM and an appropriate amount of solvent (butanone) in a container and react at 85°C for 2h, then raise the temperature to 90°C, Add 20 parts of bisphenol A epoxy resin and 15 parts of tetrabromobisphenol A epoxy resin (EC-14) to react for 1 hour to obtain a prepolymer.

[0026] The preparation method of the glue: put all the prepolymers, 10 parts of bisphenol A epoxy resin, 10 parts of tetrabromobisphenol A epoxy resin (EC-14) and an appropriate amount of solvent (butanone) in a container , heated to 60°C, stirred until completely dissolved; then added 30 parts of carboxyl-terminated liquid nitrile rubber (CTBN) toughening agent, heated and stirred until completely dissolved; added 10 parts of curing agent DDM, stirred evenly and then added 0.5 parts of curing agent Accelerator 2-ethyl-4-methylimidazole (2E4MZ), stir evenly, then add 10 parts of inorganic fille...

Embodiment 2

[0030] Preparation of prepolymer (each component is configured in parts by weight): 15 parts of BMI, 10 parts of DDM and an appropriate amount of solvent (butanone) were placed in a container and reacted at 85°C for 2h, and the temperature was raised to 90°C. Add 15 parts of bisphenol A epoxy resin and 10 parts of tetrabromobisphenol A epoxy resin (EC-14) to react for 1 hour to obtain a prepolymer.

[0031] The preparation method of the glue: put all the prepolymers, 10 parts of bisphenol A epoxy resin, 10 parts of tetrabromobisphenol A epoxy resin (EC-14) and an appropriate amount of solvent (butanone) in a container , heated to 60°C, stirred until completely dissolved; then added 25 parts of hydroxyl-terminated liquid nitrile rubber (HTBN) toughening agent, heated and stirred until completely dissolved; added 10 parts of curing agent DDM, stirred evenly and then added 0.5 parts of curing agent Accelerator 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), stir evenly, then a...

Embodiment 3

[0035]Preparation of prepolymer (each component is configured in parts by weight): put 15 parts of BMI, 10 parts of DDS and an appropriate amount of solvent (butanone) in a container and react at 85°C for 2h, then raise the temperature to 90°C, Add 20 parts of bisphenol A epoxy resin and 15 parts of tetrabromobisphenol A epoxy resin (EC-14) to react for 1 hour to obtain a prepolymer.

[0036] The preparation method of the glue solution: put all the prepolymers, 10 parts of bisphenol A epoxy resin, 5 parts of tetrabromobisphenol A epoxy resin (EC-14) and an appropriate amount of solvent (butanone) in a container , heated to 60°C, stirred until completely dissolved; then added 15 parts of hydroxyl-terminated liquid nitrile rubber (HTBN) toughening agent, heated and stirred until completely dissolved; added 5 parts of curing agent DDM, stirred evenly and then added 0.05 parts of curing agent Accelerator 2-ethyl-4-methylimidazole (2E4MZ), stir evenly, then add 10 parts of inorgani...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Peel strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a thermosetting adhesive for a flexible basic material. The thermosetting adhesive for the flexible basic material comprises a nonaqueous solvent and a solute dissolved into the nonaqueous solvent, wherein the nonaqueous solvent is butanone; and the solute consists of the following components in parts by weight: 5 to 55 parts of epoxy resin, 5 to 20 parts of polyimide, 25 to 50 parts of toughening agent, 15 to 25 parts of curing agent and 0.05 to 1 part of curing accelerator. The fragility of the adhesive is improved by adding the toughening agent, so that the adhesive has excellent toughness so as to meet the high flexibility requirement of a flexible copper clad plate; heat resistance and flexibility of the flexible copper clad plate are improved by modifying the epoxy resin by the polyimide; and fire resistance is improved by modification of tetrabromobisphenol A epoxy resin and the polyimide. The flexible copper clad plate prepared from the thermosetting adhesive is a high-performance flexible basic material, wherein the deflection times exceed 15 million; peel strength exceeds 1.4 kg / cm; and soldering resistance is that no foaming and delamination occur at the temperature of 320 DEG C in more than 30 seconds.

Description

technical field [0001] The invention relates to a high-performance thermosetting adhesive and a preparation method, in particular to a thermosetting adhesive for a flexible printed circuit base material with high flexibility and high temperature resistance and a preparation method. Background technique [0002] With the miniaturization and thinning of electronic devices (such as televisions, mobile phones, computers, digital cameras, etc.), flexible printed circuit boards (FPC) are used because of their light weight, small size, and easy bending. The connection and assembly methods of electronic components have undergone changes, and can better meet the requirements of short, light, thin, and beautiful modern electronic products. [0003] Flexible copper clad laminate (FCCL) is the substrate material for manufacturing FPC, and it is the main factor that determines the performance of flexible circuits. According to the manufacturing process and structure, it can be divided i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/02C09J179/08H05K3/00
Inventor 耿国凌李发文
Owner SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com