Super high-density perpendicular magnetic recording magnetic film and preparation method thereof
A perpendicular magnetic recording, ultra-high density technology, applied in the direction of magnetic recording, only a part of the coating supported by a magnetic layer, data recording, etc., can solve the problem of strict control of deposition conditions and equipment requirements, unfavorable operation by ordinary technicians, unfavorable Problems such as mass production, to achieve the effect of easy operation, good chemical stability and easy operation in the production process
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Embodiment 1
[0024] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 5% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 2 0=1:1:4 cleaning solution, ultrasonic cleaning at a temperature of 90°C for 30 minutes; then use a volume ratio of HCL:H 2 o 2 :H 2 0=1:0.5:4 cleaning solution, ultrasonic cleaning at 90°C for 30 minutes to remove organic and metal attachments on the surface of the silicon wafer; finally placed in absolute ethanol, ultrasonic cleaning for 30 minutes to remove the substrate surface attached moisture.
[0025] (2) Depositing magnetic thin films by magnetron sputtering: place a SmCo permanent magnet with a surface magnetic field strength of 0.5 T on the back of the cleaned single crystal silicon substrate, when the vacuum in the magnetron sputtering chamber is 3×10 -5 Pa, when the argon pressure is 0.7Pa, the Co 0.84 Fe 0.01 PtC 0.15 For thin film deposition, the single cryst...
Embodiment 2
[0031] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 20% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 2 0=1:3:5.5 cleaning solution, ultrasonic cleaning at a temperature of 70°C for 50 minutes; then use a volume ratio of HCL:H 2 o 2 :H 20=1:2:7 cleaning solution, ultrasonic cleaning at 70°C for 50 minutes to remove organic and metal attachments on the surface of the silicon wafer; finally placed in absolute ethanol, ultrasonic cleaning for 50 minutes to remove the substrate surface attached moisture.
[0032] (2) Deposit magnetic thin films by magnetron sputtering: place a NdFeB permanent magnet with a surface magnetic field strength of 1T on the back of the cleaned single crystal silicon substrate, when the vacuum in the magnetron sputtering chamber is 8×10 -5 Pa, when the argon pressure is 0.9Pa, the Co 0.19 Fe 0.01 PtC 0.15 film deposition, and control the rotation speed...
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