Method for manufacturing magnetic recording magnetic film
A magnetic thin film and perpendicular magnetic recording technology, which is applied in the fields of information storage and reproduction information recording, superlattice structure magnetic recording metal thin film, and magnetic recording, can solve the problem of strict control of deposition conditions and equipment requirements, unfavorable operation by ordinary technicians, and unfavorable Problems such as mass production, to achieve the effect of easy operation, good chemical stability and easy operation in the production process
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Embodiment 1
[0025] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 5% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 2 0=1:1:4 cleaning solution, ultrasonically clean for 30 minutes at a temperature of 90 °C; then use a volume ratio of HCL:H 2 O 2 :H 2 0=1:0.5:4 cleaning solution, ultrasonically cleaned for 30min at a temperature of 90℃ to remove organic and metal attachments on the surface of the silicon wafer; finally placed in absolute ethanol, ultrasonically cleaned for 30min, and the surface of the substrate was removed attached moisture.
[0026] (2) Deposition of magnetic thin films by magnetron sputtering: place a SmCo permanent magnet with a surface magnetic field strength of 0.5T on the back of the cleaned single-crystal silicon substrate, and when the back vacuum in the magnetron sputtering chamber is 3×10 -5 Pa, when the argon gas pressure is 0.7Pa, the Co 0.84 Fe 0.01 PtC 0.15...
Embodiment 2
[0032] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 20% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 20=1:3:5.5 cleaning solution, ultrasonically clean for 50 minutes at a temperature of 70 °C; then use a volume ratio of HCL:H 2 O 2 :H 2 0=1:2:7 cleaning solution, ultrasonically cleaned for 50min at a temperature of 70℃ to remove organic and metal attachments on the surface of the silicon wafer; finally placed in anhydrous ethanol, ultrasonically cleaned for 50min, and the surface of the substrate was removed attached moisture.
[0033] (2) Deposition of magnetic films by magnetron sputtering: place a NdFeB permanent magnet with a surface magnetic field strength of 1T on the back of the cleaned single-crystal silicon substrate, and when the vacuum in the magnetron sputtering chamber is 8×10 -5 Pa, when the argon gas pressure is 0.9Pa, the Co 0.19 Fe 0.01 PtC 0.15 depositio...
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