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Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive

A technology of water-soluble phenolic resin and copper-clad laminate, which is applied in the direction of adhesives, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., and can solve the bonding performance and heat resistance of copper foil and paper base Poor and other problems, to achieve the effect of improving the resistance to dip soldering

Inactive Publication Date: 2011-09-28
江阴市明康绝缘玻纤有限公司
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

After using the adhesive prepared by this resin, the bonding performance and heat resistance between copper foil and paper base are poor, and the peel strength can only reach 9~10N / mm under normal conditions.

Method used

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Embodiment Construction

[0010] The present invention relates to a method for preparing water-soluble phenolic resin used in the preparation of adhesives for copper-clad laminates. It uses phenol and formaldehyde as main raw materials, and uses barium hydroxide as a catalyst to generate water-soluble phenolic resin through synthesis reaction. The reaction temperature is 90°C-98°C, and the time is 45-70 minutes. During the reaction, the reaction is maintained at normal pressure. The gelation time is tested during the reaction. When the gelation time reaches the required value, the reaction is neutralized, and vacuum dehydration is carried out. The water in the resin is completely removed, but the finished product is finished by adding solvent to dilute it. The feeding mass parts of each component are: 100 parts of phenol, 100 parts of formaldehyde, and 2 to 4 parts of barium hydroxide.

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Abstract

The invention relates to a preparation method of a water-soluble phenolic resin applied to preparation of a copper-clad foil laminated board adhesive. The preparation method is characterized in that phenol and formaldehyde are used as main raw materials, barium hydroxide is used as a catalyst, and the water-soluble phenolic resin is generated through synthesis reaction, wherein the reaction temperature is 90 DEG C-98 DEG C, the reaction time is 45-70 minutes, and normal pressure is maintained when in reaction. The feeding mass parts of various components of the water-soluble phenolic resin are as follows: 100 parts of the phenol, 100 parts of the formaldehyde and 2-4 parts of the barium hydroxide. By using the preparation method, the adhesive property and heat-resistant property between a copper foil and a papery substrate can be improved.

Description

technical field [0001] The invention relates to a resin, in particular to a method for preparing a water-soluble phenolic resin used for preparing adhesives for copper-clad laminates. Background technique [0002] Before the present invention was made, in the past, phenolic resin with ammonia water as a catalyst was generally used as the resin for preparing copper clad laminate adhesives. After using the adhesive prepared by the resin, the bonding performance and heat resistance between the copper foil and the paper base are poor, and the peel strength can only reach 9~10N / mm under normal conditions. Solder dip resistance temperature can only reach 5~10 seconds in a tin bath at 260°C. Contents of the invention [0003] The object of the present invention is to overcome the above disadvantages, and provide a water-soluble phenolic resin that can improve the bonding performance and heat resistance of copper foil and paper base and is used in the preparation of adhesives for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/10C09J161/10B32B15/098B32B15/20
Inventor 王宏章
Owner 江阴市明康绝缘玻纤有限公司
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