Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same

A resin composition and resin technology, applied in circuit substrate materials, synthetic resin layered products, printed circuit parts, etc., can solve problems such as unsatisfactory flame retardancy and poor reactivity

Active Publication Date: 2011-10-05
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the poor reactivity of DOPO with epoxy resins and cross-linking agents, the flame retardancy it can achieve is still unsatisfactory. Therefore, it has been proposed in the

Method used

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  • Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same
  • Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same
  • Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A resin composition comprising the following components:

[0050] (A) Novolac epoxy resin of 100 parts by weight

[0051] (B) 30 parts by weight of DDS

[0052] (C) DOPO-BPAN resin of 40 parts by weight

[0053] (D) Dimethylimidazole of 0.1 parts by weight

Embodiment 2

[0055] A resin composition comprising the following components:

[0056] (A) 100 parts by weight of bisphenol A epoxy resin

[0057] (B) 40 parts by weight of phenol novolac (phenolic novolac) resin

[0058] (C) 20 parts by weight of DDS

[0059] (D) DOPO-BPAN resin of 20 parts by weight

[0060] (E) dimethylimidazole of 0.1 weight part

Embodiment 3

[0062] A resin composition comprising the following components:

[0063] (A) 100 parts by weight of dicyclopentadiene epoxy resin

[0064] (B) 30 parts by weight of DDS

[0065] (C) DOPO-BPAN resin of 45 parts by weight

[0066] (D) fused silica of 50 parts by weight

[0067] (E) 1 part by weight of siloxane compound

[0068] (F) 50 parts by weight of methyl ethyl copper

[0069] (G) dimethylimidazole of 0.1 parts by weight

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PUM

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Abstract

The invention relates to a resin composition which mainly comprises epoxy resin, a hardening accelerator, a cross-linking agent and phosphorus-containing resin, wherein the phosphorus-containing resin is bisphenol phenolic resin or phenolic resin substituted by a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or derivatives thereof. The resin composition can be applied to semi-solidified rubber sheets or insulating layers of circuit boards. In addition, the invention relates to a semi-solidified rubber sheet, a laminating board and a circuit board containing the resin composition.

Description

technical field [0001] The present invention relates to a kind of resin composition, especially a kind of thermosetting resin composition that can be applied to semi-cured film (prepreg) or circuit substrate insulating layer, and it mainly comprises epoxy resin, hardening accelerator, crosslinking agent and by Phosphorous resin. Background technique [0002] DOPO is a commonly used additive in the resin composition, and its main purpose is to improve the flame retardancy of the resin composition, so that the resin composition can still maintain stability when it is applied in a high temperature environment. [0003] However, due to the poor reactivity of DOPO with epoxy resins and cross-linking agents, the flame retardancy it can achieve is still unsatisfactory. Therefore, it has been proposed in the prior art to bond 1,4-bishydroxyphenol to DOPO , to form DOPO-HQ (HQ stands for hydroquinone, that is, hydroquinone), and improve its reactivity through the introduction of hy...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L61/14B32B27/04B32B17/04B32B15/092B32B15/20H05K1/03
Inventor 余利智李泽安甘若兰周立明
Owner ELITE MATERIAL
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